Production method of template, template blank, and template substrate for imprinting, production method of template for imprinting, and template

ABSTRACT

A template and a template blank are used for imprint lithography transferring a transfer pattern in a concave and convex structure to a resin on a transfer substrate, in which a first step structure is formed on a main surface of a base, a second step structure is formed on the first step structure, and an outside region of the second step structure on an upper surface of the first step structure is covered with a light shielding film to solve the above problem.

TECHNICAL FIELD

The present invention relates to a template used in nanoimprintlithography transferring a fine transfer pattern onto a resin formed ona transfer substrate, and a template blank used of producing thetemplate. In addition, the present invention also relates to a templateused in nanoimprint lithography transferring a fine transfer patternonto a resin formed on a transfer substrate, and more particularly to aproduction method of a template substrate for imprinting having a firststep structure on a main surface of a base, a second step structure onthe first step structure, and a light shielding film on an upper surfaceof the first step structure, a production method of a template forimprinting, and a template used in the production methods.

BACKGROUND ART

Nanoimprint lithography is known as a technology for transferring andforming a fine pattern, for example, in the production of a device forsemiconductor.

The above nanoimprint lithography is a technique in which a template(also referred to as a mold or a stamper) for imprinting having a fineconcavo-convex shape transfer pattern formed on a surface thereof isbrought into contact with a resin formed on a transfer substrate such asa semiconductor wafer, after that, the resin is cured, and theconcavo-convex shape (more specifically, the concavo-convex invertedshape) of the transfer pattern of the template is transferred onto theresin.

As a method of nanoimprint lithography, there are a thermal imprintingmethod of curing a resin by heating and a photo imprinting method ofcuring a resin by light exposure. For applications requiring highpositioning accuracy, a photo imprinting method that is not affected byexpansion or contraction due to heating is mainly used (for example,Patent Documents 1 and 2).

In the template used for nanoimprint lithography as described above, amesa-shaped step structure is provided on the main surface of the baseso that only a predetermined region (referred to as a transfer patternregion) in which a transfer pattern in a concavo-convex shape is formedis in contact with the resin formed on the transfer substrate, and thetransfer pattern is formed on the upper surface of the mesa-shaped stepstructure (for example, Patent Document 3). Incidentally, in thetemplate having such a structure, the upper surface of the mesa-shapedstep structure becomes the transfer pattern region.

The step difference (height from the main surface of the base to theupper surface of the step structure) of the mesa-shaped step structureas described above is determined, for example, by the mechanicalprecision of the imprinting apparatus to be used. However, the stepdifference requires typically about 30 μm.

In addition, in nanoimprint lithography, as the number of transferpatterns is increased, the adhesion area between the template and theresin is increased, so that a force against the frictional force betweenthe template and the resin is required for releasing. In particular,since transfer patterns for semiconductor applications are small in sizeand high in pattern density, a large force is required for releasing.

Therefore, there has been proposed a method in which, by forming thedepression part on the back surface side (the side opposite to the sideon which the transfer pattern is formed) of the template, the thicknessof the template in a predetermined region (region including the transferpattern region) where the transfer pattern is formed is reduced tofacilitate the bending, and during releasing, by bending the transferpattern region of the template convexly toward the transfer substrateside, the template is partly released sequentially from the outer edgepart of the transfer region (for example, Patent Document 4).

CITATION LIST Patent Document

-   -   Patent Document 1: JP 2004-504718 A    -   Patent Document 2: JP 2002-93748 A    -   Patent Document 3: JP 2014-56893 A    -   Patent Document 4: JP 2009-536591 A    -   Patent Document 5: JP 2007-103924 A

SUMMARY OF INVENTION Technical Problem

In the above-described photo imprinting method, in order to suppressunintended curing of the resin in the non-transfer region during theimprinting, it has been proposed to provide a light shielding member toa non-pattern part (a part different from the transfer pattern region)of the template (for example, Patent Document 5).

However, it is usually difficult to uniformly provide the lightshielding member on the side surface of the mesa-shaped step structureas illustrated in FIGS. 9(A), 7(B), and 7(D) of Patent Document 5.Patent Document 5 also does not disclose details of the productionmethod of obtaining the above-described form as illustrated in FIGS.9(A), 7(B), and 7(D).

In addition, in the form in which the light shielding member is providedonly on the main surface of the base as illustrated in FIG. 9(C) ofPatent Document 5, for example, as described above, in a case wherethere is a step difference of about 30 μm between the upper surface ofthe mesa-shaped step structure and the main surface of the base, theexposure light leaking from the part where the mesa-shaped stepstructure and the main surface of the base are in contact with eachother spreads and is emitted onto the resin according to the distance ofthe step difference, so that there is also a problem that the resin atan unintended part is cured.

In particular, since it takes time for dry etching to form a mesa-shapedstep structure with a step difference of about 30 μm, the step structureis usually formed by wet etching. Therefore, the cross-sectional shapeof the part where the mesa-shaped step structure and the main surface ofthe base are in contact with each other is hard to be a right angle, andthe cross-sectional shape becomes the rounded shape. Then, in therounded shape part (the part where the mesa-shaped step structure andthe main surface of the base are in contact with each other), it isdifficult to form the light shielding member with the same thickness asthe other parts, and thus, the exposure light easily leaks.

The present invention has been made in view of the above circumstances,and an object of the present invention is to provide a template and atemplate blank and a production method of a template substrate forimprinting for producing a template for imprinting, a production methodof a template for imprinting, and a template used for the productionmethods capable of suppressing influence of leakage of exposure light(irradiation to an unintended region) during imprinting whilemaintaining a required height (distance from a main surface of a base)of a transfer pattern region.

Solution to Problem

That is, according to the present invention, there is provided atemplate to be used for imprint lithography transferring a transferpattern in a concave and convex structure to a resin on a transfersubstrate, the template characterized by comprising: on a main surfaceof abase, a first step structure, a second step structure on the firststep structure, and the transfer pattern at an upper surface of thesecond step structure; wherein an outer side region of the second stepstructure at an upper surface of the first step structure is coveredwith a light shielding film.

According to the present invention, there is provided a template to beused for imprint lithography transferring a transfer pattern in aconcave and convex structure to a resin on a transfer substrate, thetemplate characterized by comprising: on a main surface of a base, afirst step structure, a second step structure on the first stepstructure, and at an upper surface of the second step structure, a firstconcave and convex structure body configuring the transfer pattern, anda second concave and convex structure body configuring an alignmentmark; wherein an outer side region of the second step structure at anupper surface of the first step structure is covered with a lightshielding film; and a high contrast film configured by a film of adifferent material from a material configuring the base, is formed onthe light shielding film and on a bottom surface of a concave part inthe second concave and convex structure body.

In the invention, when a distance in a vertical direction from the mainsurface of the base to an upper surface of the light shielding film onthe first step structure is regarded as H1, and a distance in a verticaldirection from a main surface of the base to a bottom surface of aconcave part in the transfer pattern at an upper surface of the secondstep structure is regarded as H2, a relation: H1<H2 is preferablysatisfied.

In the invention, when a distance in a vertical direction from the mainsurface of the base to an upper surface of the light shielding film onthe first step structure is regarded as H1, a distance in a verticaldirection from the main surface of the base to an upper surface of thesecond step structure is regarded as H3,

-   -   a distance in a horizontal direction from an outer edge of the        main surface of the base to an outer edge of an upper surface of        the first step structure is regarded as D1, and a distance in a        horizontal direction from the outer edge of the main surface of        the base to an outer edge of the upper surface of the second        step structure is regarded as D2, a relation: H1≤H3×(D1/D2) is        preferably satisfied.

The invention further preferably comprises a depression part includingthe second step structure at an opposite side surface to the mainsurface of the base in a planar view.

In the invention, the depression part preferably includes the first stepstructure in a planar view.

In the invention, a transmittance of the light shielding film with awave length of 365 nm is preferably 10% or less.

According to the present invention, there is provided a template blankfor producing a template to be used for imprint lithography transferringa transfer pattern in a concave and convex structure to a resin on atransfer substrate, the template blank characterized by comprising: on amain surface of a base, a first step structure, a second step structureon the first step structure; wherein an outer side region of the secondstep structure at an upper surface of the first step structure iscovered with a light shielding film.

In the invention, when a distance in a vertical direction from the mainsurface of the base to an upper surface of the light shielding film onthe first step structure is regarded as H1, and a distance in a verticaldirection from the main surface of the base to an upper surface of thesecond step structure is regarded as H4, a relation: H1<H4 is preferablysatisfied.

In the invention, when a distance in a vertical direction from the mainsurface of the base to an upper surface of the light shielding film onthe first step structure is regarded as H1, a distance in a verticaldirection from the main surface of the base to an upper surface of thesecond step structure is regarded as H4, a distance in a horizontaldirection from an outer edge of the main surface of the base to an outeredge of an upper surface of the first step structure is regarded as D1,and a distance in a horizontal direction from the outer edge of the mainsurface of the base to an outer edge of the upper surface of the secondstep structure is regarded as D2, a relation: H1≤H4×(D1/D2) ispreferably satisfied.

The invention further preferably comprises a depression part includingthe second step structure at an opposite side surface to the mainsurface of the base in a planar view.

In the invention, the depression part preferably includes the first stepstructure in a planar view.

In the invention, a transmittance of the light shielding film with awave length of 365 nm is preferably 10% or less.

According to the present invention, there is provided a productionmethod of a template substrate for imprinting, the template substrateincluding a first step structure on a main surface of a base, a secondstep structure on the first step structure, and a light shielding filmon an upper surface of the first step structure, the production methodcharacterized by comprising steps of: a multistep template substratewith a light shielding material layer preparing step of preparing amultistep template substrate with a light shielding material layerincluding the first step structure, the second step structure, and alight shielding material layer on an upper surface of the first stepstructure and on an upper surface of the second step structure; a resinlayer forming step of forming a first resin layer on the light shieldingmaterial layer formed on the upper surface of the first step structure,and forming a second resin layer thinner than a thickness of the firstresin layer, on the light shielding material layer formed on the uppersurface of the second step structure; a second resin layer removing stepof removing the second resin layer while leaving the first resin layerby dry etching; and a light shielding film forming step of etching thelight shielding material layer using the first resin layer left as amask to remove the light shielding material layer formed on the uppersurface of the second step structure while leaving the light shieldingmaterial layer formed on the upper surface of the first step structure;in this order, wherein the resin layer forming step includes: a resinthickness specifying step of, using a template for specifying resinthickness including a concave part in a main surface side contacting aresin, pushing an upper surface of an outer peripheral part of theconcave part in the template for specifying resin thickness against afirst resin dropped onto the light shielding material layer formed onthe upper surface of the first step structure, and pushing a bottomsurface of the concave part in the template for specifying resinthickness against a second resin dropped onto the light shieldingmaterial layer formed on the upper surface of the second step structure;and a depth of the concave part in the template for specifying resinthickness is smaller than a height from the upper surface of the firststep structure to the upper surface of the second step structure.

In the invention, the resin layer forming step preferably includes: theresin thickness specifying step, and a resin curing step of irradiatingan ultraviolet ray for curing the first resin and the second resin in astate the template for specifying resin thickness is pushed against, toform the first resin layer and the second resin layer.

In the invention, the multistep template substrate with a lightshielding material layer preparing step is preferably provided with: amultistep template substrate preparing step of preparing a multisteptemplate substrate including the first step structure and the secondstep structure; and a light shielding material layer forming step offorming a light shielding material layer on the upper surface of thefirst step structure and on the upper surface of the second stepstructure; in this order.

In the invention, the multistep template substrate preparing step ispreferably provided with: a one step template substrate preparing stepof preparing a one step template substrate including a one stepstructure on the main surface of the base; an etching mask forming stepof forming an etching mask in a region becoming a transfer patternregion at an upper surface of the step structure in the one steptemplate substrate; and a multistep forming step of forming a first stepstructure as a bottom step and a second step structure as an upper stepby etching the step structure using the etching mask.

According to the present invention, there is provided a productionmethod of a template for imprinting, the template including a first stepstructure on a main surface of a base, a second step structure on thefirst step structure, a light shielding film on an upper surface of thefirst step structure, and a transfer pattern in a concave and convexstructure at an upper surface of the second step structure, theproduction method characterized by comprising steps of: a multisteptemplate with a light shielding material layer preparing step ofpreparing a multistep template with a light shielding material layerincluding the first step structure, the second step structure, atransfer pattern in a concave and convex structure at the upper surfaceof the second step structure and a light shielding material layer on anupper surface of the first step structure and on an upper surface of thesecond step structure; a first and second resin layer forming step offorming a first resin layer on the light shielding material layer formedon the upper surface of the first step structure, and forming a secondresin layer thinner than a thickness of the first resin layer, on thelight shielding material layer formed on the upper surface of the secondstep structure; a second resin layer removing step of removing thesecond resin layer while leaving the first resin layer by dry etching;and a light shielding film forming step of etching the light shieldingmaterial layer using the first resin layer left as a mask to remove thelight shielding material layer formed on the upper surface of the secondstep structure while leaving the light shielding material layer formedon the upper surface of the first step structure; in this order, whereinthe first and second resin layer forming step includes: a first andsecond resin thickness specifying step of, using a template forspecifying first and second resin thickness including a concave part ina main surface side contacting a resin, pushing an upper surface of anouter peripheral part of the concave part in the template for specifyingfirst and second resin thickness against a first resin dropped onto thelight shielding material layer formed on the upper surface of the firststep structure, and pushing a bottom surface of the concave part in thetemplate for specifying first and second resin thickness against asecond resin dropped onto the light shielding material layer formed onthe upper surface of the second step structure; and a depth of theconcave part in the template for specifying first and second resinthickness is smaller than a height from the upper surface of the firststep structure to the upper surface of the second step structure.

According to the present invention, there is provided a productionmethod of a template for imprinting, the template including a first stepstructure on a main surface of a base, a second step structure on thefirst step structure, a light shielding film on an upper surface of thefirst step structure, and a transfer pattern in a concave and convexstructure on an upper surface of the second step structure, theproduction method characterized by comprising steps of: a multisteptemplate with a light shielding material layer preparing step ofpreparing a multistep template with a light shielding material layerincluding: the first step structure, the second step structure; a firstconcave and convex structure body configuring the transfer pattern and asecond concave and convex structure body configuring an alignment mark,at an upper surface of the second step structure; and a light shieldingmaterial layer on the upper surface of the first step structure and onthe upper surface of the second step structure; a first and second resinlayer forming step of forming a first resin layer on the light shieldingmaterial layer formed on the upper surface of the first step structure,and forming a second resin layer thinner than a thickness of the firstresin layer, on the light shielding material layer formed on the uppersurface of the second step structure; a second resin layer removing stepof removing the second resin layer while leaving the first resin layerby dry etching; a light shielding film forming step of forming a lightshielding layer on the upper surface of the first step structure byetching the light shielding material layer using the first resin layerleft as a mask to remove the light shielding material layer formed onthe upper surface of the second step structure while leaving the lightshielding material layer formed on the upper surface of the first stepstructure; a high contrast layer forming step of forming a high contrastlayer on the light shielding material layer, on an upper surface of aconvex part and on a bottom surface of a concave part in the firstconcave and convex structure body, as well as on an upper surface of aconvex part and on a bottom surface of a concave part in the secondconcave and convex structure body; a third to fifth resin layer formingstep of forming a third resin layer on the high contrast layer formed onthe light shielding film, forming a fourth resin layer thinner than athickness of the third resin layer on the high contrast layer formed onthe upper surface of the convex part and the bottom surface of theconcave part in the first concave and convex structure body, and forminga fifth resin layer thicker than a thickness of the fourth resin layeron the high contrast layer formed on the upper surface of the convexpart and on the bottom surface of the concave part in the second concaveand convex structure; a fourth resin layer removing step of removing thefourth resin layer while leaving the third resin layer and the fifthresin layer by dry etching; and a high contrast film forming step ofetching the high contrast layer using the third resin layer and thefifth resin layer left as a mask to remove the high contrast layerformed on the upper surface of the convex part and the bottom surface ofthe concave part in the first concave and convex structure body as wellas on the upper surface of the convex part in the second concave andconvex structure body while leaving the high contrast layer formed onthe light shielding film, and on the bottom surface of the concave partin the second concave and convex structure body; in this order, whereinthe first and second resin layer forming step includes: a first andsecond resin thickness specifying step of, using a template forspecifying first and second resin thickness including a concave part ina main surface side contacting a resin, pushing an upper surface of anouter peripheral part of the concave part in the template for specifyingfirst and second resin thickness against a first resin dropped onto thelight shielding material layer formed on the upper surface of the firststep structure, and pushing a bottom surface of the concave part in thetemplate for specifying first and second resin thickness against asecond resin dropped onto the light shielding material layer formed onthe upper surface of the second step structure; a depth of the concavepart in the template for specifying first and second resin thickness issmaller than a height from the upper surface of the first step structureto the upper surface of the second step structure; the third to fifthresin layer forming step includes: a third to fifth resin thicknessspecifying step of, using a template for specifying third to fifth resinthickness including a concave part in a main surface side contacting aresin, and a depression formed at a bottom surface side of the concavepart, pushing an upper surface of an outer peripheral part of theconcave part in the template for specifying third to fifth resinthickness against a third resin dropped onto the high contrast layerformed on the light shielding film, pushing a bottom surface of theconcave part in the template for specifying third to fifth resinthickness against a fourth resin dropped onto the high contrast layerformed on the upper surface of the convex part and on the bottom surfaceof the concave part in the first concave and convex structure body aswell as against a fifth resin dropped onto the high contrast layerformed on the upper surface of the convex part and the bottom surface ofthe concave part in the second concave and convex structure body, andpushing a bottom surface of the depression against the fifth resin; anda depth of the concave part in the template for specifying third tofifth resin thickness excluding the depression part is smaller than aheight from the upper surface of the high contrast layer formed on thelight shielding film to the upper surface of the high contrast layerformed on the bottom surface of the concave part in the first concaveand convex structure body.

In the invention, the first and second resin layer forming steppreferably includes: the first and second resin thickness specifyingstep; and a first and second resin curing step of irradiating anultraviolet ray for curing the first resin and the second resin in astate the template for specifying first and second resin thickness ispushed against, to form the first resin layer and the second resinlayer.

In the invention, the multistep template with a light shielding materiallayer preparing step is preferably provided with: a multistep templatepreparing step of preparing a multistep template including the firststep structure, the second step structure, and the transfer pattern atan upper surface of the second step structure; and a light shieldingmaterial layer forming step of forming a light shielding material layeron the upper surface of the first step structure and on the uppersurface of the second step structure; in this order.

In the invention, the multistep template preparing step is preferablyprovided with: a one step template preparing step of preparing a onestep template including a one step structure on the main surface of thebase and the transfer pattern at the upper surface of the stepstructure; an etching mask forming step of forming an etching mask in aregion at the upper surface of the step structure in the one steptemplate where the transfer pattern is formed; and a multistep formingstep of forming a first step structure as a bottom step and a secondstep structure as an upper step by etching the step structure using theetching mask; in this order.

In the invention, the multistep template with light shielding materiallayer preparing step is preferably provided with: a multistep templatepreparing step of preparing a multistep template including the firststep structure, the second step structure, and the transfer pattern atan upper surface of the second step structure; and a light shieldingmaterial layer forming step of forming a light shielding material layeron the upper surface of the first step structure and on the uppersurface of the second step structure; in this order; and the multisteptemplate preparing step is provided with: a one step template substratepreparing step of preparing a one step template substrate including aone step structure on the main surface of the base; an etching maskforming step of forming an etching mask in a region becoming thetransfer pattern at an upper surface of the step structure in the onestep template substrate; a multistep forming step of forming a firststep structure as a bottom step and a second step structure as an upperstep by etching the step structure using the etching mask; and atransfer pattern forming step of forming the transfer pattern at theupper surface of the second step structure; in this order.

According to the present invention, there is provided a templatecharacterized by comprising a concave part in a main surface sidecontacting a resin.

According to the present invention, there is provided a templatecharacterized by comprising a concave part in a main surface sidecontacting a resin, and a depression formed at a bottom surface side ofthe concave part.

The present invention further preferably comprises a mark for positionmatching at the main surface side.

Preferably, the invention further comprises a mark for position matchingat the main surface side, wherein the mark for position matching is adepression formed at an outer side of the concave part in the mainsurface, and a depth of the depression formed at a bottom surface sideof the concave part and the depth of the depression formed at the outerside of the concave part are the same.

In the invention, the bottom surface size of the concave part ispreferably 10 mm×10 mm or more and 70 mm×70 mm or less.

In the invention, the depth of the concave part is preferably 0.3 μm ormore and 10 μm or less.

Preferably, the invention is used in the production method of a templatesubstrate for imprinting and the depth of the concave part is smallerthan a height from the upper surface of the first step structure to theupper surface of the second step structure in the template substrate forimprinting.

In the invention, the bottom surface of the concave part preferably isin a size enclosing the upper surface of the second step structure inthe template substrate for imprinting.

In the invention, a region surrounded by the outer edge of the uppersurface of the outer peripheral part of the concave part is preferably:in a shape and an area same as those of a region surrounded by the outeredge of the upper surface of the first step structure in the templatesubstrate for imprinting; or in a size enclosing the region surroundedby the outer edge of the upper surface of the first step structure inthe template substrate for imprinting.

Preferably, the invention is used in the production method of a templatefor imprinting, and the depth of the concave part is smaller than aheight from the upper surface of the first step structure to the uppersurface of the second step structure in the template for imprinting.

In the invention, a bottom surface of the concave part is preferably ina size enclosing the upper surface of the second step structure in thetemplate for imprinting.

In the invention, a region surrounded by an outer edge of an uppersurface of an outer peripheral part of the concave part is preferably:in a shape and an area same as those of a region surrounded by an outeredge of an upper surface of the first step structure in the template forimprinting; or in a size enclosing the region surrounded by the outeredge of the upper surface of the first step structure in the templatefor imprinting.

Advantageous Effects of Invention

In the template according to the present invention, it is possible tosuppress the influence of the leakage of exposure light (irradiation toan unintended region) during the imprinting while maintaining therequired height (the distance from the main surface of the base) of thetransfer pattern region.

In addition, it is possible to easily produce the above-describedtemplate by using the template blank according to the present invention.

According to a production method of a template substrate for imprintingof the present invention, it is possible to produce a template substratefor imprinting having a first step structure on a main surface of abase, having a second step structure on the first step structure, andhaving a light shielding film on an upper surface of the first stepstructure without generating a defective part or a thin film part in thelight shielding film.

In addition, according to a production method of a template forimprinting of the present invention, it is possible to produce atemplate for imprinting having a first step structure on a main surfaceof a base, having a second step structure on the first step structure,having a light shielding film on an upper surface of the first stepstructure, and having a transfer pattern in a concave and convexstructure on an upper surface of the second step structure withoutgenerating a defective part or a thin film part in the light shieldingfilm.

Then, in the template for imprinting produced by the production methodof the template for imprinting according to the present invention, it ispossible to suppress influence of leakage of exposure light (irradiationto an unintended region) during imprinting while maintaining a requiredheight (a distance from the main surface of the base) of the transferpattern region.

In addition, by using the template substrate for imprinting produced bythe production method of the template substrate for imprinting accordingto the present invention, it is possible to easily produce the templatefor imprinting as described above.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram illustrating a configuration example of a templateaccording to a first embodiment.

FIG. 2 is a diagram illustrating a usage example of the templateaccording to the first embodiment.

FIGS. 3A and 3B are diagrams illustrating functions and effects of thetemplate according to the first embodiment.

FIG. 4 is a diagram illustrating a positional relationship of stepstructures of the template according to the first embodiment.

FIG. 5 is a diagram illustrating a configuration example of a templateaccording to a second embodiment.

FIG. 6 is a diagram illustrating an example of main parts of a templateaccording to the second embodiment.

FIG. 7 is a diagram illustrating a configuration example of a templateblank according to the present invention.

FIG. 8 is a diagram illustrating a positional relationship of stepstructures of the template blank according to the present invention.

FIG. 9 is a flowchart illustrating an example of a production method ofthe template blank according to the present invention.

FIGS. 10A to 10C are schematic process diagrams illustrating an exampleof the production method of the template blank according to the presentinvention.

FIGS. 11D to 11F are schematic process diagrams illustrating the exampleof the production method of the template blank according to the presentinvention, following FIG. 10C.

FIGS. 12A and 12B are diagrams illustrating a problem of a template inthe related art.

FIG. 13 is a diagram illustrating an example of a template substrate forimprinting according to the present invention.

FIG. 14 is a diagram illustrating an example of a template forimprinting according to the present invention.

FIG. 15 is a flowchart illustrating an example of a production method ofthe template substrate according to the present invention.

FIG. 16 is a flowchart illustrating an example of a resin layer formingstep according to the present invention.

FIGS. 17A to 17C are schematic process diagrams illustrating an exampleof a production method of the template substrate for imprintingaccording to the present invention.

FIGS. 18D to 18F are schematic process diagrams illustrating the exampleof the production method of the template substrate according to thepresent invention, following FIG. 17C.

FIGS. 19A and 19B are diagrams illustrating an example of a template forspecifying resin thickness according to the present invention.

FIG. 20 is a diagram illustrating the function and effect of thetemplate for specifying resin thickness according to the presentinvention.

FIGS. 21A and 21B are diagrams illustrating another example of thetemplate for specifying resin thickness according to the presentinvention.

FIG. 22 is a flowchart illustrating an example of a production method ofa multistep template substrate with the light shielding material layeraccording to the present invention.

FIGS. 23A to 23C are schematic process diagrams illustrating an exampleof the production method of the multistep template substrate with thelight shielding material layer according to the present invention.

FIGS. 24D and 24E are schematic process diagrams illustrating theexample of the production method of the multistep template substratewith the light shielding material layer according to the presentinvention, following FIG. 23C.

FIG. 25 is a flowchart illustrating an example of a production method ofa multistep template with the light shielding material layer accordingto a first embodiment.

FIGS. 26A to 26C are schematic process diagrams illustrating the exampleof the production method of the multistep template with the lightshielding material layer according to the first embodiment.

FIGS. 27D and 27E are schematic process diagrams illustrating an exampleof a production method of a multistep template with the light shieldingmaterial layer according to the first embodiment, following FIG. 26C.

FIG. 28 is a flowchart illustrating another example of a productionmethod of a multistep template with the light shielding material layeraccording to a second embodiment.

FIGS. 29A to 29C are schematic process diagrams illustrating anotherexample of the production method of the multistep template with thelight shielding material layer according to the second embodiment.

FIGS. 30D to 30F are schematic process diagrams illustrating anotherexample of the production method of the multistep template with thelight shielding material layer according to the second embodiment,following FIG. 29C.

FIG. 31 is a flowchart illustrating an example of a production method ofa template according to the second embodiment.

FIGS. 32A to 32C are schematic process diagrams illustrating an exampleof the production method of the template according to the secondembodiment.

FIGS. 33D to 33F are schematic process diagrams illustrating the exampleof the production method of the template according to the secondembodiment, following FIG. 32C.

FIG. 34 is a flowchart illustrating another example of the productionmethod of the template according to the second embodiment.

FIGS. 35A to 35C are schematic process diagrams illustrating anotherexample of the production method of the template according to the secondembodiment.

FIGS. 36D to 36F are schematic process diagrams illustrating anotherexample of the production method of the template according to the secondembodiment, following FIG. 35C.

FIGS. 37G to 37I are schematic process diagrams illustrating anotherexample of the production method of the template according to the secondembodiment, following FIG. 36F.

FIGS. 38J to 38L are schematic process diagrams illustrating anotherexample of the production method of the template according to the secondembodiment, following FIG. 37I.

FIGS. 39A and 39B are diagrams illustrating another example of thetemplate for specifying resin thickness according to the presentinvention.

FIG. 40 is a diagram illustrating the function and effect of thetemplate for specifying resin thickness according to the presentinvention.

DESCRIPTION OF EMBODIMENTS

Hereinafter, a template and a template blank according to the presentinvention and a production method of a template substrate forimprinting, a production method of a template for imprinting, and atemplate according to the present invention will be described in detailwith reference to the drawings.

I. Template and Template Blank

Templates and template blanks according to the present invention will bedescribed in detail with reference to the drawings.

<Template>

First, the templates according to the present invention will bedescribed.

The templates according to the present invention are substantiallyclassified into a first embodiment and a second embodiment. Hereinafter,the first embodiment and the second embodiment will be described.

A. First Embodiment

First, a template according to the first embodiment will be described.FIG. 1 is a diagram illustrating a configuration example of the templateaccording to the first embodiment.

For example, as illustrated in FIG. 1, the template 1 has a first stepstructure 21 on a main surface 11 of a base 10, has a second stepstructure 22 on the first step structure 21, and has a transfer pattern23 on an upper surface of the second step structure 22, and an outerside region of the second step structure 22 at an upper surface of thefirst step structure 21 is covered with a light shielding film 31.

Incidentally, in the template 1, the upper surface of the second stepstructure 22 becomes the transfer pattern region.

With the above-described configuration, in the template 1, it ispossible to suppress the influence of leakage of exposure light(irradiation to an unintended region) during the imprinting whilemaintaining the required height (the distance from the main surface 11of the base 10) of the transfer pattern region.

For example, by setting the combined height (H2) of the step differenceof the first step structure 21 and the step difference of the secondstep structure 22 in the template 1 illustrated in FIG. 1 to about 30μm, in the template 1, the height (the distance from the main surface 11of the base 10) of the transfer pattern region can be maintained at arequired height.

In addition, since the template 1 has the light shielding film 31 on theupper surface of the first step structure 21, in comparison with a form(for example, FIG. 7C in Patent Document 5) in which a light shieldingmember is provided only on the main surface 11 of the base 10 as in therelated art, the light shielding film 31 exists at a distance closer tothe upper surface of the second step structure 22 which is the transferpattern region in the vertical direction (the Z direction in thefigure). Therefore, it is possible to suppress the influence of leakageof exposure light (irradiation to an unintended region) during theimprinting.

This function and effect will be described in detail with reference toFIGS. 3A to 3B and 12A to 12B. Before that, first, an example ofimprinting using template 1 will be described with reference to FIG. 2.

FIG. 2 is a diagram illustrating a usage example of the templateaccording to the first embodiment.

For example, as illustrated in FIG. 2, in the case of transferring apattern to the transfer region 61 of the photocurable resin 60 formed onthe transfer substrate 50 by the photo imprinting method using thetemplate 1, it is necessary to prevent the exposure light (for example,ultraviolet light having a wavelength of 365 nm) from being emitted ontothe non-transfer region 62 of the photocurable resin 60. This is becauseunintended curing of the photocurable resin 60 in the non-transferregion 62 is prevented.

Herein, usually, in an imprinting apparatus on which the template 1 ismounted, for the purpose of suppressing irradiation of an unintendedregion with exposure light, a frame-shaped light shielding plate in aplanar view in which the exposure region is an opening is provided.

For example, in the example illustrated in FIG. 2, since the lightshielding plate 70 is provided, the region irradiated with the exposurelight is defined in the irradiation region 90 corresponding to theopening of the light shielding plate 70. In other words, the exposurelight 83 outside the irradiation region 90 is shielded by the lightshielding plate 70 and is not emitted onto the photocurable resin 60.

However, with this light shielding plate 70 alone, since the distancefrom the photocurable resin 60 on the transfer substrate 50 may be faraway (for example, the template 1 is interposed in the middle), it isdifficult to prevent the exposure light from being emitting onto thenon-transfer region 62 of the photocurable resin 60 with good positionalaccuracy.

Therefore, including the shape accuracy and positional accuracy of thelight shielding plate 70, the irradiation region 90 defined by the lightshielding plate 70 is usually designed to be larger than the transferregion 61 of the photocurable resin 60. That is, as illustrated in FIG.2, the irradiation region 90 includes not only an irradiation region 91having a size corresponding to the transfer region 61 of thephotocurable resin 60 but also an unnecessary irradiation region 92.

Therefore, in the template 1, as illustrated in FIG. 2, the exposurelight 82 in the irradiation region 92 is shielded by the light shieldingfilm 31 formed on the upper surface of the first step structure 21. As aresult, in principle, only the exposure light 81 of the irradiationregion 91 having a size corresponding to the transfer region 61 isemitted onto the photocurable resin 60 on the transfer substrate 50.

Incidentally, as described above, in the template 1 mounted on theimprinting apparatus having the light shielding plate 70 for regulatingthe irradiation region 90 of the exposure light, as illustrated in FIGS.1 and 2, the light shielding film 31 formed on the upper surface of thefirst step structure 21 is not necessarily formed so as to cover theentire region from the part (that is, the outer edge of the bottom ofthe second step structure 22) where the second step structure 22 and theupper surface of the first step structure 21 are in contact with eachother to the outer edge of the upper surface of the first step structure21 but may be formed in the region necessary to shield the exposurelight 82.

More specifically, in the template 1, the light shielding film 31 formedon the upper surface of the first step structure 21 may be formed so asto cover at least the region from the part (that is, the outer edge ofthe bottom of the second step structure 22) where the second stepstructure 22 and the upper surface of the first step structure 21 are incontact with each other to the outer edge of the upper surface of thefirst step structure 21 in the region corresponding to the irradiationregion 90 illustrated in FIG. 2.

However, as in the template 1 illustrated in FIG. 1, as long as thelight shielding film 31 formed on the upper surface of the first stepstructure 21 covers the entire region from the part (that is, the outeredge of the bottom of the second step structure 22) where the secondstep structure 22 and the upper surface of the first step structure 21are in contact with each other to the outer edge of the upper surface ofthe first step structure 21, even though the shape accuracy and thepositional accuracy of the light shielding plate 70 illustrated in FIG.2 are low, it is possible to more reliably prevent the photocurableresin 60 in the non-transfer region 62 from unintentionally being cured.

Next, the influence of leakage of exposure light during the imprintingwill be described in more detail with reference to FIGS. 3A to 3B and12A to 12B.

Herein, FIGS. 3A and 3B are diagrams illustrating the function andeffect of the template according to the first embodiment, FIG. 3A is aschematic cross-sectional diagram of the template according to the firstembodiment, and FIG. 3B is a schematic enlarged diagram illustrating theleakage state of the exposure light L1 in the region R2 illustrated inFIG. 3A. In addition, FIGS. 12A and 12B are diagrams illustratingproblems of the template in the related art, FIG. 12A is a schematiccross-sectional diagram of the template in the related art, and FIG. 12Bis a schematic enlarged diagram illustrating the leakage state of theexposure light L2 in the region R102 illustrated in FIG. 12A.

First, the influence of leakage of exposure light during the imprintingin a template in the related art will be described with reference toFIGS. 12A and 12B.

As illustrated in FIG. 12A, in the template 101 in the related art whichhas a step structure 121 on a main surface 111 of a base 110 and has atransfer pattern 122 on an upper surface of the step structure 121 andin which an outer side region of the step structure 121 at the mainsurface 111 of the base 110 is covered with alight shielding film 131,the upper surface (transfer pattern region) of the step structure 121and the main surface 111 (more precisely, the upper surface of the lightshielding film 131) of the base 110 are separated by the distance H101.

The distance H101 is determined, for example, by the mechanical accuracyof the imprinting apparatus to be used. However, the distance istypically about 30 μm.

Therefore, as illustrated in FIG. 12B, there is a problem that theexposure light L2 leaking from the part where the step structure 121 andthe main surface 111 of the base 110 are in contact with each otherspreads as diffracted light depending on the distance H101, so that theresin in the region corresponding to A2 is cured at the height of theupper surface (transfer pattern region) of the step structure 121.

Furthermore, since the step structure 121 requiring about 30 μm in stepdifference (corresponding to approximately H101) takes time to produceby dry etching, the step structure is usually formed by wet etching.

Therefore, the cross-sectional shape of the part where the stepstructure 121 and the main surface 111 of the base 110 are in contactwith each other is hard to be a right angle, and the cross-sectionalshape tends to be a rounded shape as illustrated in FIG. 12B.

Then, in this rounded shape part (the part where the step structure 121and the main surface 111 of the base 110 are in contact with eachother), it is difficult to form the light shielding film 131 with thesame thickness as the other parts, and thus, the exposure light easilyleaks. For example, in the example illustrated in FIG. 12B, it isdifficult to form the light shielding film 131 with the same thicknessas other parts in the region corresponding to A3.

Incidentally, as illustrated in FIG. 12B, in principle, the exposurelight L3 directed to the side surface of the step structure 121 istotally reflected, so that it can be considered that the problem thatthe photocurable resin 60 in the non-transfer region 62 isunintentionally cured by the exposure light L3 does not occur inprinciple.

For example, if the refractive index of synthetic quartz which isappropriately used as a material of a template at a wavelength of 365 nmis about 1.47 and the refractive index of air is assumed to be 1.0, theexposure light L3 having an incident angle θ of 43° or more is totallyreflected, so that light is not emitted from the side surface of thestep structure 121.

Next, the influence of leakage of exposure light during the imprintingin the template according to the first embodiment will be described withreference to FIGS. 3A and 3B.

As illustrated in FIG. 3A, in the template 1 according to the firstembodiment which has the first step structure 21 on the main surface 11of the base 10, has the second step structure 22 on the first stepstructure 21, and has the transfer pattern 23 on the upper surface ofthe second step structure 22 and which has a form where an outer sideregion of the second step structure 22 at an upper surface of the firststep structure 21 is covered with the light shielding film 31, the uppersurface (more precisely, the bottom surface of the concave part of thetransfer pattern 23) of the second step structure 22 and the uppersurface (more precisely, the upper surface of the light shielding film31) of the first step structure 21 are separated by a distance (H2−H1).

Incidentally, in the template 1, the combined height (H2) of the stepdifference of the first step structure 21 and the step difference of thesecond step structure 22 serves as the height of about 30 μm, which isrequired, for example, depending on the mechanical precision of theimprinting apparatus to be used.

Therefore, as illustrated in FIG. 3B, the exposure light L1 leaking fromthe part where the second step structure 22 and the upper surface of thefirst step structure 21 are in contact with each other spreads asdiffracted light depending on the distance (H2−H1). However, since thedistance (H2−H1) can be made smaller than the distance H101 (about 30μm) illustrated in FIG. 12B, it is possible to suppress the spreading tobe small.

For this reason, at the position of the height of the upper surface(transfer pattern region) of the second step structure 22, the region(corresponding to A1 illustrated in FIG. 3B) where the resin may becured can also be formed to be smaller than the region corresponding toA2 illustrated in FIG. 12B.

Furthermore, in the second step structure 22 in which the stepdifference is substantially (H2−H1), for example, if the step differenceis several μm or less, the step difference can be sufficiently formed interms of time by dry etching.

Therefore, as illustrated in FIG. 3B, by using the dry etching, thecross-sectional shape of the part where the second step structure 22 andthe upper surface of the first step structure 21 are in contact witheach other can be formed at a right angle compared to a rounded shapeillustrated in FIG. 12B.

Therefore, it is easy to form the light shielding film 31 with the samethickness as the other parts also in the part where the second stepstructure 22 and the upper surface of the first step structure 21 are incontact with each other, so that the leakage of the exposure light L1 iseasily suppressed.

Incidentally, the first step structure 21 in which the step differenceis substantially H1 may be formed by wet etching as in the related art.

In this case, similarly to the example illustrated in FIG. 12B, thecross-sectional shape of the part where the first step structure 21 andthe main surface 11 of the base 10 are in contact with each other tendsto have a rounded shape. However, in the first embodiment, since thelight shielding film 31 formed on the upper surface of the second stepstructure 22 is responsible for shielding the exposure light, the effectof the light shielding film 31 is not impaired by the rounded shape.

The value of the distance (H2−H1) can be applied as long as the value ofthe distance is smaller than the height (typically about 30 μm)required, for example, depending on the mechanical accuracy of theimprinting apparatus to be used. However, as described above, for thepurpose of suppressing the influence of leakage of exposure light(irradiation to an unintended region) during the imprinting, the smallerthe value is, the more effective the value is.

On the other hand, for the purpose of preventing the photocurable resin60 formed on the transfer substrate 50 from adhering to the lightshielding film 31 during the imprinting, as illustrated in FIG. 2, it ispreferable that a gap (space) is formed between the upper surface (thedownward direction in FIG. 2) of the light shielding film 31 and thebottom surface (the same as the position of the upper surface of thephotocurable resin 60 in FIG. 2) of the concave part of the transferpattern 23.

In other words, as illustrated in FIG. 1, in a case where the distancein the vertical direction from the main surface 11 of the base 10 to theupper surface of the light shielding film 31 on the first step structure21 is regarded as H1 and the distance in the vertical direction from themain surface 11 of the base 10 to the bottom surface of the concave partof the transfer pattern 23 on the upper surface of the second stepstructure 22 is regarded as H2, it is preferable that a relationship ofH1<H2 is satisfied.

As a range that satisfies both of the purpose of suppressing theinfluence of leakage of exposure light during the imprinting and thepurpose of preventing the photocurable resin from adhering to the lightshielding film 31 during the imprinting, for example, theabove-described distance (H2−H1) can be set to be in a range of 1 μm ormore and 5 μm or less.

In addition, in the template 1, as illustrated in FIG. 4, in a casewhere the distance in the vertical direction from the main surface 11 ofthe base 10 to the upper surface of the light shielding film 31 on thefirst step structure 21 is regarded as H1, the distance in the verticaldirection from the main surface 11 of the base 10 to the upper surfaceof the second step structure 22 is regarded as H3, the distance in thehorizontal direction from the outer edge of the main surface 11 of thebase 10 to the outer edge of the upper surface of the first stepstructure 21 is regarded as D1, and the distance in the horizontaldirection from the outer edge of the main surface 11 of the base 10 tothe outer edge of the upper surface of the second step structure 22 isregarded as D2, it is preferable that a relationship of H1≤H3×(D1/D2) issatisfied.

Incidentally, FIG. 4 is a diagram illustrating the positionalrelationship of step structures of the template according to the firstembodiment and corresponds to an enlarged diagram of main parts of R1indicated by a broken line circle in FIG. 1.

In a case where the relationship is satisfied, as illustrated in FIG. 4,the outer edge E2 of the light shielding film 31 on the first stepstructure 21 exists in an inner side (on the template 1 side) than thebroken line connecting the outer edge E1 of the main surface 11 of thebase 10 and the outer edge E3 of the upper surface of the second stepstructure 22.

Therefore, this is because, during the imprinting as illustrated in FIG.2, even if the template 1 (more precisely, the upper surface of thesecond step structure 22 of the template 1) does not face horizontallyand is in contact with the transfer substrate 50 (more precisely, thephotocurable resin 60 formed on the transfer substrate 50) with aninclination, the outer edge E2 (furthermore, the light shielding film 31on the first step structure 21) can be prevented from being in contactwith the transfer substrate 50 (more precisely, the photocurable resin60 formed on the transfer substrate 50).

In addition, in the template 1, as illustrated in FIG. 1, it ispreferable that a depression part 40 including the second step structure22 in a planar view is provided on the surface (back surface 12)opposite to the main surface 11 of the base 10. This is because a stepsuch as releasing becomes easy.

More specifically, this is because by reducing the thickness of thetemplate 1 in the region (transfer pattern region) where the transferpattern 23 is formed to facilitate bending, the transfer pattern regionof the template 1 is bent convexly toward the transfer substrate sideduring the releasing, so that it is possible to perform partiallyreleasing sequentially from the outer edge part of the transfer region61 of the photocurable resin 60 formed on the transfer substrate 50.

Furthermore, as illustrated in FIG. 1, it is preferable that thedepression part 40 includes the first step structure 21 in a planarview. This is because it is possible to prevent a problem that the lightshielding film 31 formed on the upper surface of the first stepstructure 21 is peeled off during the bending.

More specifically, since the inside of the depression part 40 is easilydeformed during the bending because the thickness of the template 1 issmall, whereas the outside of the depression part 40 is not easilydeformed during the bending because the thickness of the template 1 islarge.

Therefore, in a planar view, in a case where the first step structure 21is not included in the depression part 40, in other words, in a planarview, in a case where the first step structure 21 exists not only insidethe depression part 40 but also outside the depression part 40, thefirst step structure 21 has a boundary between the region (that is,inside the depression part 40) that is easily deformed and the region(that is, outside the depression part 40) that is not easily deformed.

Then, since the stress is concentrated on the boundary during thebending, while the imprinting is repeated, the light shielding film 31formed on the upper surface of the first step structure 21 is peeledoff, and thus, there is a concern that the boundary becomes the originof defect.

Therefore, in order to prevent such a boundary from being formed in thefirst step structure 21, as illustrated in FIG. 1, such a form that thedepression part 40 includes the first step structure 21 in a planar viewis provided.

Next, the material constituting the template 1 will be described.

The main material constituting the template 1, that is, the materialconstituting the base 10, the first step structure 21, the second stepstructure 22, and the transfer pattern 23 is a material that can be usedfor the photo imprinting method and can transmit exposure light duringthe imprinting.

In general, ultraviolet light having a wavelength in a range of 200 nmto 400 nm (in particular, in a range of 300 nm to 380 nm) is used as theexposure light.

Examples of the above-mentioned material include transparent materialssuch as quartz glass, heat-resistant glass, calcium fluoride (CaF₂),magnesium fluoride (MgF₂), and acrylic glass and stacked structures ofthese transparent materials. In particular, synthetic quartz is suitablebecause the synthetic quartz has high rigidity, low thermal expansioncoefficient, and high transmittance in a range of commonly usedwavelength of 300 nm to 380 nm.

Incidentally, in general, in the template used for nanoimprintlithography, the main material constituting the base and the mainmaterial constituting the step structure having the transfer pattern arethe same material, and also in the template 1, the first step structure21 and the second step structure 22 having the transfer pattern 23 aremade of the same material as the base 10.

As a material constituting the light shielding film 31, for example, amaterial containing at least one of a metal material and oxide, nitride,and oxynitrides thereof can be used. Specific examples of theabove-mentioned metal material which can be used include chromium (Cr),molybdenum (Mo), tantalum (Ta), tungsten (W), zirconium (Zr), andtitanium (Ti).

Herein, in order to prevent irradiation with exposure light, it ispreferable that the light shielding film 31 has a transmittance of 10%or less at a wavelength of 365 nm.

For example, in a case where chromium (Cr) is used as a material of thelight shielding film 31, the thickness of the light shielding film 31may be 15 nm or more.

Incidentally, in addition, the transfer pattern of the template forimprinting according to the first embodiment may be a line-and-spacepattern or a pillar shape. As an example, in the case of aline-and-space pattern, the line width is about 30 nm and the heightthereof is about 60 nm. In addition, in the case of the pillar shape,the diameter is about 50 nm, and the height thereof is about 60 nm.

Incidentally, in a case where the template 1 is viewed in plan, thewidth in the longitudinal direction and the width in the lateraldirection of the first step structure 21 or the second step structure 22are particularly limited as long as the widths satisfy theabove-mentioned conditions, and the width in the longitudinal directionand the width in the lateral direction may be the same as each other ordifferent from each other.

B. Second Embodiment

Next, the template according to the second embodiment will be described.FIG. 5 is a diagram illustrating a configuration example of the templateaccording to the second embodiment.

For example, as illustrated in FIG. 5, the template 1 has a first stepstructure 21 on the main surface 11 of the base 10, has a second stepstructure 22 on the first step structure 21, and has a transfer pattern23 on the upper surface of the second step structure 22, and an outerside region of the second step structure 22 at an upper surface of thefirst step structure 21 is covered with the light shielding film 31.

The template 1 has, on the upper surface of the second step structure22, a first concave and convex structure body 22 a constituting thetransfer pattern 23 and a second concave and convex structure body 22 bconstituting an alignment mark. A high contrast film 32 made of amaterial film different from the material constituting the base 10 isformed on the light shielding film 31 and on the bottom surface of theconcave part of the second concave and convex structure body 22 b.

Incidentally, the high contrast film 32 is formed on the lower side ofthe concave part of the second concave and convex structure body 22 b.In addition, in the template 1, the upper surface of the second concaveand convex structure body 22 b becomes the transfer pattern region.

Due to the above-described configuration, similarly to the template 1illustrated in FIG. 1, in the template 1 it is possible to suppress theinfluence of leakage of exposure light (irradiation to an unintendedregion) during the imprinting, while maintaining the required height(the distance from the main surface 11 of the base 10) of the transferpattern region.

In addition, in the above-described configuration, the high contrastfilm 32 is formed on the bottom surface of the concave part of thesecond concave and convex structure body 22 b constituting the alignmentmark, and the light shielding film 31 and the high contrast film 32 aresequentially stacked on the outer side region of the second stepstructure 22 at an upper surface of the first step structure 21. Forthis reason, in the template 1 illustrated in FIG. 5, it is possible tosatisfy both requirements of improving the contrast of the alignmentmark during the position alignment and preventing light irradiation toan unintended region during the imprinting. In addition, since the lightshielding property of the stacked structure in which the light shieldingfilm 31 and the high contrast film 32 are sequentially stacked is higherthan the light shielding property of only the light shielding film 31illustrated in FIG. 1, for example, the exposure light 82 in theoriginally unnecessary irradiation region 92 illustrated in FIG. 2 canbe more effectively shielded than that of the template 1 illustrated inFIG. 1.

On the other hand, in the template 1 illustrated in FIG. 5, similarly tothe space between the upper surface of the light shielding film 31 ofthe template 1 and the bottom surface of the concave part of thetransfer pattern 23 illustrated in FIG. 1, it is preferable that a gap(space) is formed between the upper surface of the high contrast film 32formed on the light shielding film 31 and the bottom surface of theconcave part of the transfer pattern 23.

In other words, as illustrated in FIG. 5, in a case where the distancein the vertical direction from the main surface 11 of the base 10 to theupper surface of the high contrast film 32 formed on the light shieldingfilm 31 is regarded as H11 and the distance in the vertical directionfrom the main surface 11 of the base 10 to the bottom surface of theconcave part of the transfer pattern 23 on the upper surface of thesecond step structure 22 is regarded as H12, it is preferable that arelationship of H11<H12 is satisfied.

In addition, in the template 1 illustrated in FIG. 5, as a range thatsatisfies both the purpose of suppressing the influence of leakage ofexposure light during the imprinting and the purpose of preventing thephotocurable resin from adhering to the light shielding film 31 duringthe imprinting. For example, the value of the distance (H12−H11) betweenthe bottom surface of the concave part of the transfer pattern 23 andthe upper surface of the high contrast film 32 formed on the lightshielding film 31 can be set to be in a range of 1 μm or more and 5 μmor less.

In addition, in the template 1 illustrated in FIG. 5, for the samereason as the relationship of H11 and H13 in the template 1 illustratedin FIG. 1, in a case where the distance in the vertical direction fromthe main surface 11 of the base 10 to the upper surface of the highcontrast film 32 formed on the light shielding film 31 is regarded asH11, the distance in the vertical direction from the main surface 11 ofthe base 10 to the upper surface of the second step structure 22 isregarded as H13, the distance in the horizontal direction from the outeredge of the main surface 11 of the base 10 to the outer edge of theupper surface of the first step structure 21 is regarded as D11, and thedistance in the horizontal direction from the outer edge of the mainsurface 11 of the base 10 to the outer edge of the upper surface of thesecond step structure 22 is regarded as D12, it is preferable that arelationship of H11≤H13×(D11/D12) is satisfied.

In addition, in the template 1 illustrated in FIG. 5, for the samereason as the template 1 illustrated in FIG. 1, it is preferable that adepression part 40 including the second step structure 22 in a planarview is provided on the surface (back surface 12) opposite to the mainsurface 11 of the base 10.

Furthermore, for the same reason as the template 1 illustrated in FIG.1, it is preferable that the depression part 40 includes the first stepstructure 21 in a planar view.

Next, the relationship between the depths of the first concave andconvex structure body 22 a constituting the transfer pattern 23 and thesecond concave and convex structure body 22 b constituting the alignmentmark will be described.

FIG. 6 is a diagram illustrating an example of the main parts of thetemplate according to the second embodiment.

In the template 1 illustrated in FIG. 5, as illustrated in FIG. 6, in acase where the distance from the upper surface of the convex part to thebottom surface of the concave part of the first concave and convexstructure body 22 a is regarded as D13 and the distance from the uppersurface of the convex part to the upper surface of the high contrastfilm 32 on the bottom surface of the concave part of the second concaveand convex structure body 22 b is regarded as D14, it is preferable thatthe relationship D13≤D14 is satisfied.

This is because, with such a configuration, when producing the templatefor imprinting according to the present invention, it is possible tofurther increase the thickness of the resin layer (the fifth resin layer55 formed on the bottom surface of the concave part of the secondconcave and convex structure body 22 b illustrated in FIG. 38J) as anetching mask remaining on the high contrast film 32 on the bottomsurface of the concave part of the second concave and convex structurebody 22 b, and thus, during the etching, it is possible to more reliablyprevent the problem that the high contrast film 32 on the bottom surfaceof the concave part of the second concave and convex structure body 22 bdisappears.

The form as described above can be obtained by the method described in,for example, Japanese Patent Application No. 2014-193694.

That is, in the production method of the template for imprintingaccording to the present invention to be described later, it is possibleto obtain the template for imprinting by forming a hard mask patternwhich is to be an etching mask when forming the first concave and convexstructure body 22 a and the second concave and convex structure body 22b, after that, half-etching the second concave and convex structure body22 b in a state where the hard mask pattern region for forming the firstconcave and convex structure body 22 a is covered with the resin layer,and after that, by removing the resin layer and forming the firstconcave and convex structure body 22 a and the second concave and convexstructure body 22 by etching.

Next, the material constituting the template 1 illustrated in FIG. 5 andthe thickness of each film will be described.

Since the main material constituting the template 1 illustrated in FIG.5, that is, the material constituting the base 10, the first stepstructure 21, and the second step structure 22 is similar to that of thetemplate 1 illustrated in FIG. 1, the description thereof will beomitted herein. In addition, since the material constituting the firstconcave and convex structure body 22 a and the second concave and convexstructure body 22 b in the template 1 illustrated in FIG. 5 is similarto the material constituting the transfer pattern 23 in the template 1illustrated in FIG. 1, the description thereof will be omitted herein.

As the material constituting the light shielding film 31, unlike thematerial constituting the base 10, any material having light shieldingproperties can be used. For example, the same material as the lightshielding film 31 in the template 1 illustrated in FIG. 1 can be used.

Herein, in order to prevent irradiation with the exposure light, it ispreferable that the light shielding film 31 has a transmittance of 10%or less at a wavelength of 365 nm.

For example, in a case where chromium (Cr) is used as a material of thelight shielding film 31, the thickness of the light shielding film 31may be 15 nm or more. In particular, the thickness is preferably withina range of 35 nm to 1000 nm, particularly preferably within a range of55 nm to 1000 nm. This is because the thickness of the light shieldingfilm 31 is larger than these lower limits, so that the transmittance ata wavelength of 365 nm is 1% or less and the transmittance at awavelength of 365 nm is 0.1% or less, and this is because the thicknessof the light shielding film 31 is smaller than these upper limits, sothat film peeling can be avoided.

As the material constituting the high contrast film 32, any materialhaving a refractive index different from that of the materialconstituting the base 10 with respect to the alignment light and havinga light shielding property can be used. For example, the same materialas the light shielding film 31 in the template 1 illustrated in FIG. 1can be used.

Although the thickness of the high contrast film 32 is not particularlylimited as long as the thickness can satisfy the requirement of contrastof the alignment mark during the position alignment and the requirementof light shielding property, in the production method of the templatefor imprinting having a high contrast film described later, it ispreferable to make the thickness as large as possible by forming thehigh contrast film 32 as thick as possible. This is because the contrastof the alignment mark is improved.

Although the thickness of the high contrast film 32 cannot be greatlychanged due to restrictions on the structure and manufacturing of thefirst concave and convex structure body 22 a and the second concave andconvex structure body 22 b, the thickness of the light shielding film 31can be greatly changed. On the first step structure 21 where the lightshielding film 31 and the high contrast film 32 are formed to beoverlapped, it is preferable to regulate the thickness of the lightshielding film 31 so that the thickness satisfying the requirement oflight shielding can be obtained.

Incidentally, since the transfer pattern of the template for imprintingaccording to the second embodiment is similar to the transfer pattern ofthe template for imprinting according to the first embodiment, thedescription thereof will be omitted herein.

<Template Blank>

Next, the template blank according to the present invention will bedescribed. FIG. 7 is a diagram illustrating a configuration example ofthe template blank according to the present invention.

For example, as illustrated in FIG. 7, the template blank 2 has, on themain surface 11 of the base 10, the first step structure 21 and thesecond step structure 22 on the first step structure 21, and an outerside region of the second step structure 22 at an upper surface of thefirst step structure 21 is covered with a light shielding film 31.

The template blank 2 is a template blank of producing the template 1.For example, the template 1 as illustrated in FIG. 1 can be produced byforming the transfer pattern 23 having a concave and convex structure onthe upper surface of the second step structure 22 of the template blank2.

Then, as described above, in the template 1, it is possible to suppressthe influence of leakage of exposure light (irradiation to an unintendedregion) during the imprinting while maintaining the required height ofthe transfer pattern region.

Herein, in the template blank 2 illustrated in FIG. 7, the distance H4in the vertical direction from the main surface 11 of the base 10 to theupper surface of the second step structure 22 corresponds to the sum ofthe distance H2 and the height of the convex part of the transferpattern 23 in the template 1 illustrated in FIG. 1.

However, since the distance H2 is about 30 μm and the height of theconvex part of the transfer pattern 23 is about 60 nm (about 1/500 of 30μm), the distance H4 illustrated in FIG. 7 can be treated asapproximately the same value as the distance H2 illustrated in FIG. 1.

Similarly to the distance (H2−H1) in the template 1 illustrated in FIG.1, the value of the distance (H4−H1) in the template blank 2 illustratedin FIG. 7 can be applied as long as the value of the distance is smallerthan the height (typically about 30 μm) required, for example, dependingon the mechanical accuracy of the imprinting apparatus to be used.However, as described above, for the purpose of suppressing theinfluence of leakage of exposure light during the imprinting of thetemplate 1, the smaller the value, the more effective the value is.

On the other hand, as described above, for the purpose of preventing thephotocurable resin 60 formed on the transfer substrate 50 from adheringto the light shielding film 31 of the template 1 during the imprinting,as illustrated in FIG. 2, it is preferable that a gap (space) is formedbetween the upper surface (the downward direction in FIG. 2) of thelight shielding film 31 and the bottom surface (the same as the positionof the upper surface of the photocurable resin 60 in FIG. 2) of theconcave part of the transfer pattern 23.

Therefore, also in the template blank 2, as illustrated in FIG. 7, in acase where the distance in the vertical direction from the main surface11 of the base 10 to the upper surface of the light shielding film 31 onthe first step structure 21 is regarded as H1 and the distance in thevertical direction from the main surface 11 of the base 10 to the uppersurface of the second step structure 22 is regarded as H4, it ispreferable that a relationship of H1<H4 is satisfied.

As a range that satisfies both of the purpose of suppressing theinfluence of leakage of exposure light during the imprinting of thetemplate 1 and the purpose of preventing the photocurable resin fromadhering to the light shielding film 31 of the template 1 during theimprinting, for example, the above-described value of the distance(H4−H1) can be set to be in a range of 1 μm or more and 5 μm or less.

In addition, in the template blank 2, as illustrated in FIG. 8, in acase where the distance in the vertical direction from the main surface11 of the base 10 to the upper surface of the light shielding film 31 onthe first step structure 21 is regarded as H1, the distance in thevertical direction from the main surface 11 of the base 10 to the uppersurface of the second step structure 22 is regarded as H4, the distancein the horizontal direction from the outer edge of the main surface 11of the base 10 to the outer edge of the upper surface of the first stepstructure 21 is regarded as D1, and the distance in the horizontaldirection from the outer edge of the main surface 11 of the base 10 tothe outer edge of the upper surface of the second step structure 22 isregarded as D2, it is preferable that a relationship of H1≤H4×(D1/D2) issatisfied.

Incidentally, FIG. 8 is a diagram illustrating the positionalrelationship of step structures of the template blank according to thepresent invention and corresponds to an enlarged diagram of main partsof R3 illustrated by a broken line circle in FIG. 7.

In a case where the relationship is satisfied, as illustrated in FIG. 8,the outer edge E2 of the light shielding film 31 on the first stepstructure 21 exists in an inner side (on the template blank 2 side) thanthe broken line connecting the outer edge E1 of the main surface 11 ofthe base 10 and the outer edge E3 of the upper surface of the secondstep structure 22.

Therefore, this is because, during the imprinting of the template 1 asillustrated in FIG. 2, even if the template 1 (more precisely, the uppersurface of the second step structure 22 of the template 1) does not facehorizontally and is in contact with the transfer substrate 50 (moreprecisely, the photocurable resin 60 formed on the transfer substrate50) with an inclination, the outer edge E2 (furthermore, the lightshielding film 31 on the first step structure 21) can be prevented frombeing in contact with the transfer substrate 50 (more precisely, thephotocurable resin 60 formed on the transfer substrate 50).

In addition, in the template blank 2, as illustrated in FIG. 7, it ispreferable that a depression part 40 including the second step structure22 in a planar view is provided on a surface (back surface 12) oppositeto the main surface 11 of the base 10. This is because a step such asreleasing of the template 1 becomes easy.

More specifically, this is because, with such a configuration, it ispossible to reduce the thickness of the template blank 2 in the regionwhere the second step structure 22 is formed, so that in the template 1,by reducing the thickness of the region (transfer pattern region) wherethe transfer pattern 23 is formed to facilitate bending, the transferpattern region of the template 1 is bent convexly toward the transfersubstrate side during the releasing, so that it is possible to performpartially releasing sequentially from the outer edge part of thetransfer region 61 of the photocurable resin 60 formed on the transfersubstrate 50.

Furthermore, as illustrated in FIG. 7, it is preferable that thedepression part 40 includes the first step structure 21 in a planarview. This is because it is possible to prevent a problem that the lightshielding film 31 formed on the upper surface of the first stepstructure 21 is peeled off during the bending.

More specifically, the inside of the depression part 40 is a region thatis easily deformed during the bending of the template 1 because thethickness of the template blank 2 is small, whereas the outside of thedepression part 40 is a region that is not easily deformed during thebending of the template 1 since the thickness of the template blank 2 islarge.

Therefore, in a planar view, in a case where the first step structure 21is not included in the depression part 40, in other words, in a planarview, in a case where the first step structure 21 exists not only insidethe depression part 40 but also outside the depression part 40, thefirst step structure 21 has a boundary between the region (that is,inside the depression part 40) that is easily deformed and the region(that is, outside the depression part 40) that is not easily deformed.

Then, since the stress is concentrated on the boundary during thebending of the template 1, while the imprinting is repeated, the lightshielding film 31 formed on the upper surface of the first stepstructure 21 is peeled off, and thus, there is a concern that theboundary becomes the original of defect.

Therefore, in order to prevent such a boundary from being formed in thefirst step structure 21, as illustrated in FIG. 7, such a form that thedepression part 40 includes the first step structure 21 in a planar viewis provided.

As the material constituting the template blank 2, the same material asthe above-described template 1 can be used.

<Production Method of Template Blank>

Next, a production method of a template blank according to the presentinvention will be described.

FIG. 9 is a flowchart illustrating an example of the production methodof the template blank according to the present invention. In addition,FIGS. 10A to 10C and 11D to 11F are schematic process diagramsillustrating an example of the production method of the template blankaccording to the present invention.

Incidentally, the template according to the present invention can beproduced by forming the transfer pattern 23 on the upper surface of thesecond step structure 22 by the same method as the method in the relatedart using the template blank according to the present invention.Therefore, the description of the production method of the templateaccording to the present invention with reference to the drawings willbe omitted.

For example, in order to produce the template blank 2 by this productionmethod, first, a first template blank 200 having a mesa-shaped stepstructure 201 on the main surface 11 of the base 10 is prepared (S1 inFIG. 9, FIG. 10A).

As the first template blank 200, a template blank which does not havethe first step structure 21, the second step structure 22, and the lightshielding film 31 as in the template blank 2, for example, a templateblank which is the same as the template blank used for the photoimprinting method in the related art can be used.

The first template blank 200 is made of, for example, synthetic quartz.

The distance H201 from the main surface 11 of the base 10 to the uppersurface of the step structure 201 is approximately the same as thedistance H4 of the template blank 2 illustrated in FIG. 7 and istypically about 30 μm.

In addition, it is preferable that a depression part 40 is provided onthe back surface 12 side of the base 10.

Next, a first etching mask 210 is formed on the upper surface of thestep structure 201 (S2 in FIG. 9, FIG. 10B).

For example, the first etching mask 210 can be formed by performingsputtering film formation using chromium (Cr) and, after that,performing a patterning process in a mask shape.

Next, the first step structure 21 and the second step structure 22 areformed by dry etching by using the first etching mask 210 as a mask (S3in FIG. 9, FIG. 10C). As the etching gas, for example, a fluorine-basedgas can be used.

Herein, the distance H202 (corresponding to the etching depth)illustrated in FIG. 10C is about several μm (in a range of 1 μm or moreand 5 μm or less).

Next, the first etching mask 210 is removed (FIG. 11D), andsubsequently, the light shielding material layer 220, which is to be thelight shielding film 31 later, is formed on the main surface 11 of thebase 10, the upper surface of the first step structure 21, and the uppersurface of the second step structure 22, and the second etching mask 230is formed in the outer side region of the second step structure 22 at anupper surface of the first step structure 21 (S4 and S5 in FIG. 9, FIG.11E).

For example, the light shielding material layer 220 can be formed bysputtering film formation using chromium (Cr) so that the thickness is15 nm or more.

In addition, the second etching mask 230 made of a resin can be formedby dropping a resin onto the outer side region of the second stepstructure 22 at an upper surface of the first step structure 21.

Next, by removing the light shielding material layer 220 exposed fromthe second etching mask 230 and, after that, removing the second etchingmask 230, the template blank 2 which has the first step structure 21 onthe main surface 11 of the base 10 and has the second step structure 22on the first step structure 21 and in which the outer side region of thesecond step structure 22 at an upper surface of the first step structure21 is covered with the light shielding film 31 is obtained (S6 in FIG.9, FIG. 11F).

Heretofore, although the template and the template blank according tothe present invention have been described above, the present inventionis not limited to the above-described embodiments. The above-describedembodiments are examples, and in any cases, those having substantiallythe same configuration and having the same functions and effects as thetechnical idea disclosed in the claims of the present invention areincluded in the technical scope of the present invention.

II. Production Method of Template Substrate for Imprinting, ProductionMethod of Template for Imprinting, and Template

A production method of a template substrate for imprinting, a productionmethod of a template for imprinting, and a template according to thepresent invention will be described in detail with reference to thedrawings.

<Template Substrate for Imprinting and Template for Imprinting>

First, a template substrate for imprinting produced by the productionmethod according to the present invention and a template for imprintingwill be described.

Incidentally, in order to avoid complication, the template substrate forimprinting and the template for imprinting are appropriately simplyreferred to as a template substrate and a template, respectively.

FIG. 13 is a diagram illustrating an example of the template substrateaccording to the present invention. In addition, FIG. 14 is a diagramillustrating an example of the template according to the presentinvention.

For example, as illustrated in FIG. 13, the template substrate 4 has afirst step structure 21 on a main surface 11 of a base 10 and has asecond step structure 22 on the first step structure 21, and an outerside region of the second step structure 22 at an upper surface (exposedtable, terrace) of the first step structure 21 is covered with a lightshielding film 31.

The template substrate 4 is a template substrate of producing a template1 having the light shielding film 31 as illustrated in FIG. 14, and itis possible to produce the template 1 as illustrated in FIG. 14, forexample, by forming a transfer pattern in a concave and convex structureon the upper surface of the second step structure 22 of the templatesubstrate 4. Incidentally, in the template 1 illustrated in FIG. 14, theupper surface of the second step structure 22 becomes the transferpattern region.

In addition, in the template 1, it is possible to suppress the influenceof leakage of exposure light (irradiation to an unintended region)during the imprinting while maintaining the required height of thetransfer pattern region.

For example, by producing the combined height of the step difference ofthe first step structure 21 and the step difference of the second stepstructure 22 in the template 1 illustrated in FIG. 14 to a requiredheight (for example, 30 μm), in the template 1, the height (the distancefrom the main surface 11 of the base 10) of the transfer pattern regioncan be maintained at a required height (for example, 30 μm).

In addition, since the template 1 has the light shielding film 31 on theupper surface of the first step structure 21, in comparison with a form(for example, FIG. 7C in Patent Document 5) in which a light shieldingmember is provided only on the main surface 11 of the base 10 as in therelated art, the light shielding film 31 exists at a distance closer tothe upper surface of the second step structure 22 which is the transferpattern region in the vertical direction (the Z direction in thefigure). Therefore, it is possible to suppress the influence of leakageof exposure light (irradiation to an unintended region) during theimprinting.

For example, the value of the step difference (H1) of the second stepstructure 22 can be set to be in a range of 1 μm or more and 5 μm orless. If the step difference is several μm or less, the step differencecan be sufficiently formed in terms of time by dry etching.

Therefore, by formation by the dry etching, the cross-sectional shape ofthe part where the second step structure 22 and the upper surface of thefirst step structure 21 are in contact with each other can be formed ata right angle compared to the case of formation by wet etching.

Therefore, it is easy to form the light shielding film 31 with the samethickness as the other parts also in the part where the second stepstructure 22 and the upper surface of the first step structure 21 are incontact with each other, so that the leakage of the exposure light L1 iseasily suppressed.

<Production Method of Template Substrate for Imprinting>

Next, a production method of the template substrate for imprintingaccording to the present invention will be described.

FIG. 15 is a flowchart illustrating an example of the production methodof the template substrate for imprinting according to the presentinvention. In addition, FIG. 16 is a flowchart illustrating an exampleof a resin layer forming step according to the present invention. FIGS.17A to 17C and 18D to 18F are schematic process diagrams illustrating anexample of the production method of the template substrate forimprinting according to the present invention.

The production method of the template substrate for imprinting accordingto the present invention is a production method of a template substratefor imprinting having a first step structure on a main surface of abase, having a second step structure on the first step structure, andhaving a light shielding film on an upper surface of the first stepstructure, and as illustrated in FIG. 15, includes, in order, amultistep template substrate with the light shielding material layerpreparing step (S10) of preparing a multistep template substrate withthe light shielding material layer having the first step structure andthe second step structure and having the light shielding material layeron the upper surface of the first step structure and the upper surfaceof the second step structure, a resin layer forming step (S20) offorming a first resin layer on the light shielding material layer formedon the upper surface of the first step structure and forming a secondresin layer of which the thickness is smaller than that of the firstresin layer on the light shielding material layer formed on the uppersurface of the second step structure, a second resin layer removing step(S30) of removing the second resin layer by dry etching while allowingthe first resin layer to remain, and a light shielding film forming step(S40) of removing the light shielding material layer formed on the uppersurface of the second step structure by etching the light shieldingmaterial layer by using the remaining first resin layer as a mask whileallowing the light shielding material layer formed on the upper surfaceof the first step structure to remain.

Then, the resin layer forming step (S20) includes a resin thicknessspecifying step (S21 in FIG. 16) of, by using a template for specifyingresin thickness having a concave part having a rectangular shape in aplanar view on the main surface side in contact with the resin, pressingthe upper surface of the outer peripheral part of the concave part ofthe template for specifying resin thickness against the first resindropped onto the light shielding material layer formed on the uppersurface of the first step structure, and pressing the bottom surface ofthe concave part of the template for specifying resin thickness againstthe second resin dropped onto the light shielding material layer formedon the upper surface of the second step structure, and the depth of theconcave part of the template for specifying resin thickness is smallerthan the height from the upper surface of the first step structure tothe upper surface of the second step structure.

Hereinafter, each step will be explained in order.

(Preparation of Multistep Template Substrate with Light ShieldingMaterial Layer)

For example, in order to produce the template substrate 4 by thisproduction method, first, a multistep template substrate 300 with alight shielding material layer which has the first step structure 21 andthe second step structure 22 and has a light shielding material layer170 on the upper surface (exposed table, terrace) of the first stepstructure 21 and on the upper surface of the second step structure 22 isprepared (S10 in FIG. 15, FIG. 17A).

In the multistep template substrate 300 with the light shieldingmaterial layer, the combined height of the first step structure 21 andthe second step structure 22 is a height which is the same as or similarto the step difference of the template substrate having a one stepstructure used in the photo imprinting method in the related art and istypically about 30 μm. In addition, it is preferable that a depressionpart 40 is provided on the back surface 12 side of the base 10.

As illustrated in FIGS. 22 to 24E, for example, the multistep templatesubstrate 300 with the light shielding material layer can be producedfrom a template substrate having a one step structure used in a photoimprinting method in the related art. The production method of themultistep template substrate with the light shielding material layerwill be described later in detail.

(Resin Layer Formation)

Next, as illustrated in FIG. 17B, by dropping the first resin 51 a ontothe light shielding material layer 170 formed on the upper surface ofthe first step structure 21, dropping the second resin 52 a onto thelight shielding material layer 170 formed on the upper surface of thesecond step structure 22, after that, as illustrated in FIG. 17C,pressing the template 400 for thickness regulation of the resin todefine the thickness of each resin (S21 in FIG. 16), curing the firstresin 51 a and the second resin 52 a in this state (S22 in FIG. 16), andafter that, releasing the template 400 for thickness regulation of theresin, as illustrated in FIG. 18D, the first resin layer 51 and thesecond resin layer 52, each having a defined thickness, are obtained(S20 in FIG. 15).

Herein, in the production method, by using the template 400 forthickness regulation of the resin having a predetermined form, thethickness of the second resin layer 52 can be formed so as to be smallerthan the thickness of the first resin layer 51.

In addition, by using the template 400 for thickness regulation of theresin, as illustrated in FIG. 18D, the first resin layer 51 can beformed as a resin layer having a uniform thickness. For example, theheight difference of the thickness of the first resin layer 51 can beset to be 50 nm or less.

(Second Resin Layer Removal)

Next, as illustrated in FIG. 18E, by dry etching (etch-back) by usingthe etching gas 75, the second resin layer 52 is removed while allowingthe first resin layer 51 to remain.

As described above, since the thickness of the second resin layer 52 issmaller than the thickness of the first resin layer 51, by the etch-backmethod, the second resin layer 52 can be removed while allowing thefirst resin layer 51 to remain.

As the etching gas 75, for example, oxygen gas can be used.

(Light Shielding Film Formation)

Next, by using the remaining first resin layer 51 as a mask, the lightshielding material layer 170 exposed from the first resin layer 51 isetched, so that the light shielding material layer 170 formed on theupper surface of the second step structure 22 is removed while allowingthe light shielding material layer 170 formed on the upper surface ofthe first step structure 21 to remain. The light shielding materiallayer 170 formed on the upper surface of the first step structure 21remaining in this step becomes the light shielding film 31 of thetemplate substrate 4.

For example, in a case where a material containing chromium (Cr) is usedfor the light shielding material layer 170, any one of dry etching andwet etching can be used for this etching. For example, in the case ofdry etching, the dry etching by using a mixed gas of oxygen and chlorinecan be used. In addition, in the case of wet etching, the wet etching byusing an aqueous solution containing ceric ammonium nitrate andperchloric acid can be used.

After that, by removing the remaining first resin layer 51, asillustrated in FIG. 18F, the template substrate 4 having the first stepstructure 21 on the main surface 11 of the base 10, having the secondstep structure 22 on the first step structure 21, and having the lightshielding film 31 on the upper surface (exposed table, terrace) of thefirst step structure 21 can be obtained.

For removing the remaining first resin layer 51, for example, ashing byusing oxygen gas can be used.

(Problem 1 of the Related Art)

Herein, in the step illustrated in FIG. 17B, in a case where the secondresin 52 a is not dropped onto the light shielding material layer 170formed on the upper surface of the second step structure 22 (that is,the resin layer is not formed on the light shielding material layer 170formed on the upper surface of the second step structure 22) and thelight shielding material layer 170 formed on the upper surface of thesecond step structure 22 is to be removed by etching, there is a problemthat it is not possible to prevent the first resin 51 a from adhering tothe light shielding material layer 170 formed on the upper surface ofthe second step structure 22, for example, due to splashes when thefirst resin 51 a is dropped, and the unnecessary light shieldingmaterial layer 170 also remains on the upper surface of the second stepstructure 22 of the template substrate 4 illustrated in FIG. 18F due tothis unnecessary first resin 51 a.

(Problem 2 of the Related Art)

In addition, as illustrated in FIG. 17B, only by dropping the firstresin 51 a onto the light shielding material layer 170 formed on theupper surface of the first step structure 21, the formed resin layer hasa defective part (a part without resin) or a thin film part (a part witha thin resin) according to the density distribution of the dropped firstresin 51 a. Then, if dry etching (etch-back) illustrated in FIG. 18E isperformed, such a defective part and a thin film part are furtherincreased.

Therefore, there is a problem that, if the light shielding materiallayer 170 is etched in a subsequent step, the light shielding materiallayer 170 formed on the upper surface of the first step structure 21which is to be the light shielding film 31 also has a defective part ora thin film part.

(Effect of Production Method According to the Present Invention)

On the other hand, in the production method of the template substratefor imprinting according to the present invention, as illustrated inFIG. 17C, by using the template 400 for thickness regulation of theresin having a predetermined form, the thickness of the second resinlayer 52, for example, including splashes when the first resin 51 a isdropped can be formed to be smaller than the thickness of the firstresin layer 51. Besides, both the first resin layer 51 and the secondresin layer 52 can be formed as a resin layer having a uniformthickness.

Then, as illustrated in FIG. 18E, by the etch-back method, the secondresin layer 52 can be removed while allowing the first resin layer 51 toremain.

Therefore, in the subsequent step, the light shielding material layer170 exposed from the first resin layer 51 is etched, so that asillustrated in FIG. 18F, on the upper surface of the second stepstructure 22, the light shielding material layer 170 can be removedwithout allowing the light shielding material layer 170 to remain.

In addition, since the first resin layer 51 can be formed as a resinlayer having a uniform thickness without a defective part, the lightshielding material layer 170 formed on the upper surface of the firststep structure 21 which is to be the light shielding film 31 can also bea film without a defective part or a thin film part.

(Resin)

The first resin 51 a and the second resin 52 a are made of a materialthat is cured by heat or light and are preferably ultraviolet curableresins used in the field of nanoimprint lithography.

In a case where the first resin 51 a and the second resin 52 a areultraviolet curable resins, in the step of curing the first resin 51 aand the second resin 52 a (S22 in FIG. 16), as illustrated in FIG. 17C,a method of irradiating with the ultraviolet light 65 can be used.

Incidentally, the first resin 51 a and the second resin 52 a may be madeof different materials as long as the second resin layer 52 can beremoved by dry etching in the second resin layer removing step describedlater (S30 in FIG. 15, FIG. 18E) while allowing the first resin layer 51to remain. However, from the viewpoint of ease of handling, it ispreferable that these resins are made of the same material.

(Template for Thickness Regulation of Resin)

FIGS. 19A and 19B are diagrams illustrating an example of the templatefor specifying resin thickness according to the present invention.Herein, FIG. 19A illustrates a schematic bottom diagram of the template400 for thickness regulation of the resin, and FIG. 19B illustrates across sectional diagram taken along line A-A in FIG. 19A.

For example, the template 400 for thickness regulation of the resinillustrated in FIGS. 19A and 19B has a concave part 402 on the mainsurface side (lower side in FIG. 19B) which is in contact with resin,and the concave part 402 is surrounded by a frame-shaped convex part 403in a planar view. That is, in the template 400 for thickness regulationof the resin, the upper surface of the outer peripheral part of theconcave part 402 corresponds to the upper surface of the frame-shapedconvex part 403 in a planar view.

More specifically, in a planar view, the concave part 402 of thetemplate 400 for thickness regulation of the resin has a size ofenclosing the upper surface of the second step structure 22 of themultistep template substrate 300 with the light shielding material layerand being enclosed in a region surrounded by the outer edge of the uppersurface of the first step structure 21 of the multistep templatesubstrate 300 with the light shielding material layer, and the depth ofthe concave part 402 of the template 400 for thickness regulation of theresin is set to be smaller than the height from the upper surface of thefirst step structure 21 to the upper surface of the second stepstructure 22 of the multistep template substrate 300 with the lightshielding material layer.

FIG. 20 is a diagram illustrating the function and effect of thetemplate for specifying resin thickness according to the presentinvention. FIG. 20 corresponds to an enlarged diagram of the main partsin FIG. 17C.

For example, as illustrated in FIG. 20, when defining the thicknesses ofthe first resin layer 51 and the second resin layer 52 by pressing thetemplate 400 for thickness regulation of the resin, in a case where theheight (the same as the height from the upper surface of the first stepstructure 21 to the upper surface of the second step structure 22 of thetemplate substrate 4 for imprinting) from the upper surface of the firststep structure 21 to the upper surface of the second step structure 22of the multistep template substrate 300 with the light shieldingmaterial layer is regarded as H1, the depth (the same as the height ofthe convex part 403 in the template 400 for thickness regulation of theresin illustrated in FIG. 19) of the concave part 402 is regarded as H2,the thickness of the first resin layer 51 to be formed is regarded asT1, and the thickness of the second resin layer 52 to be formed isregarded as T2, by designing so that H2<H1, a relationship of T2<T1 isobtained.

For example, the depth H2 of the concave part 402 may be in a range of0.3 μm or more and 10 μm or less.

Therefore, if this template 400 for thickness regulation of the resin isused in the step illustrated in FIG. 17C, the thickness of the secondresin layer 52 can be formed so as to be smaller than the thickness ofthe first resin layer 51. In addition, by using the template 400 forthickness regulation of the resin, as illustrated in FIG. 18D, the firstresin layer 51 can be formed as a resin layer having a uniformthickness.

As a result, as illustrated in FIG. 18F, on the upper surface of thesecond step structure 22, the light shielding material layer 170 can beremoved without allowing the light shielding material layer 170 toremain, and the light shielding material layer 170 formed on the uppersurface of the first step structure 21 which is to be the lightshielding film 31 can be a film without a defective part or a thin filmpart.

Herein, it is preferable that the bottom surface of the concave part 402of the template 400 for thickness regulation of the resin has a size ofenclosing the upper surface (the same as the upper surface of the secondstep structure 22 of the template substrate 4 for imprinting) of thesecond step structure 22 of the multistep template substrate 300 withthe light shielding material layer.

More specifically, in a case where the width of the bottom surface ofthe concave part 402 of the template 400 for thickness regulation of theresin illustrated in FIG. 19B is regarded as L21 and the width of theupper surface of the second step structure 22 of the template substrate4 for imprinting illustrated in FIG. 13 is regarded as L11, it ispreferable that a relationship of L21>L11 is satisfied.

This is because the step of pressing the template 400 for thicknessregulation of the resin and the step of releasing the template 400 forthickness regulation of the resin from the multistep template substrate300 with the light shielding material layer become easier.

For example, a bottom surface size of the concave part 402 may be set tobe in a range of 10 mm×10 mm or more and 70 mm×70 mm or less.

In addition, it is preferable that the region surrounded by the outeredge of the upper surface of the outer peripheral part of the concavepart 402 of the template 400 for thickness regulation of the resin hasthe same shape and the same area as the region surrounded by the outeredge of the upper surface (the same as the upper surface of the firststep structure 21 of the template substrate for imprinting) of the firststep structure 21 of the multistep template substrate 300 with the lightshielding material layer or has a size of enclosing the regionsurrounded by the outer edge of the upper surface (the same as the uppersurface of the first step structure 21 of the template substrate forimprinting) of the first step structure 21 of the multistep templatesubstrate 300 with the light shielding material layer.

More specifically, in a case where the width of the region surrounded bythe outer edge of the upper surface of the convex part 403 of thetemplate 400 for thickness regulation of the resin illustrated in FIG.19B is regarded as L22 and the width of the region surrounded by theouter edge of the upper surface of the first step structure 21 of thetemplate substrate 4 for imprinting illustrated in FIG. 13 is regardedas L12, it is preferable that a relationship of L22≥L12 is satisfied.

This is because the first resin layer 51 can be formed as a resin layerhaving a uniform thickness without a defective part to the extent ofreaching the outer edge of the upper surface (the same as the uppersurface of the first step structure 21 of the template substrate 4 forimprinting) of the first step structure 21 of the multistep templatesubstrate 300 with the light shielding material layer.

In addition, it is preferable that the template 400 for thicknessregulation of the resin has a region 404 having the same depth as theconcave part 402 on the outer peripheral side of the convex part 403.

For example, as illustrated in FIG. 17C, when pressing the template 400for thickness regulation of the resin, it is usually difficult todirectly measure the position of the height of the concave part 402 inorder to bring the bottom surface of the concave part 402 of thetemplate 400 for thickness regulation of the resin and the upper surfaceof the second step structure 22 of the multistep template substrate 300with the light shielding material layer uniformly into contact with eachother.

This is because, for example, the measurement light is shielded by theconvex part 403 and the multistep template substrate 300 with the lightshielding material layer.

On the other hand, if the template 400 for thickness regulation of theresin has the region 404 as described above, when pressing the template400 for thickness regulation of the resin, for example, the measurementlight is not shielded by the convex part 403 and the multistep templatesubstrate 300 with the light shielding material, and it is possible tomeasure the position of the height of the region 404. Therefore, fromthis measurement result, the position of the height of the concave part402 can be grasped.

In addition, it is preferable that the template 400 for thicknessregulation of the resin has marks for position matching on the mainsurface side.

This is because, as illustrated in FIG. 17C, when pressing the template400 for thickness regulation of the resin, the relative positions withrespect to the multistep template substrate 300 with the light shieldingmaterial layer can be aligned, and thus, the pressing can be performedwith good positional accuracy.

FIGS. 21A and 21B are diagrams illustrating another example of thetemplate for specifying resin thickness according to the presentinvention.

For example, the template 410 for thickness regulation of the resinillustrated in FIG. 21A has a depression part 415 including the concavepart 412 in a planar view on the surface opposite to the main surfaceside.

With such a configuration, this is because it is possible to facilitatebending by reducing the thickness of the region where the concave part412 of the template 410 for thickness regulation of the resin isprovided, it is possible to further exclude mixing of air bubbles duringthe pressing, and it is possible to perform partially releasingsequentially from the outer edge part of the concave part 412 during thereleasing.

In addition, besides a form in which the concave part 402 is surroundedby the frame-shaped convex part 403 in a planar view as in the template400 for thickness regulation of the resin illustrated in FIGS. 19A and19B, the template for specifying resin thickness according to thepresent invention may be a form in which the outer edge of the uppersurface of the outer peripheral part of the concave part 422 reaches theouter edge of the template for specifying resin thickness as in thetemplate 420 for thickness regulation of the resin illustrated in FIG.21B.

Even with such a configuration, similarly to the template 400 forthickness regulation of the resin illustrated in FIGS. 19A and 19B, thisis because the thickness of the second resin layer 52 can be formed soas to be smaller than the thickness of the first resin layer 51. Inaddition, the first resin layer 51 can also be formed as a resin layerhaving a uniform thickness.

Furthermore, in addition to such a configuration, as in the template 410for thickness regulation of the resin illustrated in FIG. 21A, adepression part including the concave part 422 may be provided on thesurface opposite to the main surface side in a planar view.

With such a configuration, this is because it is possible to facilitatebending by reducing the thickness of the region where the concave part422 of the template 420 for thickness regulation of the resin isprovided, it is possible to further exclude mixing of air bubbles duringthe pressing, and it is possible to perform partially releasingsequentially from the outer edge part of the concave part 422 during thereleasing.

<Production Method of Multistep Template Substrate with Light ShieldingMaterial Layer>

Next, a production method of the multistep template substrate with thelight shielding material layer according to the present invention willbe described.

FIG. 22 is a flowchart illustrating an example of the production methodof the multistep template substrate with the light shielding materiallayer according to the present invention. FIGS. 23A to 23C and 24D to24E are schematic process diagrams illustrating an example of theproduction method of the multistep template substrate with the lightshielding material layer according to the present invention.

The production method of the multistep template substrate with the lightshielding material layer according to the present invention includes, inorder, a one step template substrate preparing step (S11 in FIG. 22) ofpreparing a one step template substrate having a one step structure on amain surface of a base, an etching mask forming step (S12 in FIG. 22) offorming an etching mask in a region which is to be a transfer patternregion of an upper surface of the step structure of the one steptemplate substrate, a multistep forming step (S13 in FIG. 22) of forminga first step structure of the lower step and a second step structure ofthe upper step by etching the step structure by using the etching mask,and a light shielding material layer forming step (S14 in FIG. 22) offorming a light shielding material layer on an upper surface of thefirst step structure and on an upper surface of the second stepstructure.

Hereinafter, the production method will be described in order along withthe steps.

(One Step Template Substrate Preparation)

For example, in order to produce the multistep template substrate 300with the light shielding material layer by this production method,first, a one step template substrate 150 having a one step structure 151is prepared on the main surface 11 of the base 10 (FIG. 23A).

The material constituting the one step template substrate 150 is amaterial that can be used for the photo imprinting method and cantransmit exposure light during the imprinting.

In general, ultraviolet light having a wavelength in a range of 200 nmto 400 nm (in particular, in a range of 300 nm to 380 nm) is used as theexposure light.

Examples of the above-mentioned material include transparent materialssuch as quartz glass, heat-resistant glass, calcium fluoride (CaF₂),magnesium fluoride (MgF₂), and acrylic glass and stacked structures ofthese transparent materials. In particular, synthetic quartz is suitablebecause the synthetic quartz has high rigidity, low thermal expansioncoefficient, and high transmittance in a range of commonly usedwavelength of 300 nm to 380 nm.

In the one step template substrate 150, the height H101 of the stepstructure 151 is a height which is the same as or similar to the stepdifference of the template substrate having a one step structure used inthe photo imprinting method in the related art and is typically about 30m.

In addition, it is preferable that a depression part 40 is provided onthe side of the back surface 12 of the base 10 of the one step templatesubstrate 150.

(Etching Mask Formation)

Next, an etching mask 160 is formed in a region which is to be atransfer pattern region on the upper surface of the step structure 151of the one step template substrate 150 (FIG. 23B).

Incidentally, the above-mentioned “region which is to be a transferpattern region” denotes a region where the transfer pattern 23 is formedin a template 1 for imprinting finally produced (FIG. 14) through amultistep template substrate 300 with the light shielding material layerproduced from the one step template substrate 150. In the template 1illustrated in FIG. 14, the upper surface of the second step structure22 corresponds to a transfer pattern region.

As a material constituting the etching mask 160, any material can beused as long as the material serves as an etching mask in dry etchingthe material constituting the one step template substrate 150 in thefollowing multistep forming step.

For example, a metal material and one containing at least one of oxide,nitride, and oxynitride thereof can be used. Specific examples of theabove-mentioned metal material which can be used include chromium (Cr),molybdenum (Mo), tantalum (Ta), tungsten (W), zirconium (Zr), andtitanium (Ti).

For example, by forming a chromium (Cr) film having a thickness of 30 nmor more and 200 nm or less by sputtering film formation, applying aphotoresist, performing pattering, and after that, etching the chromium(Cr) film exposed from the photoresist, a desired etching mask 160 canbe formed. For etching the chromium (Cr) film, for example, dry etchingwith a mixed gas of oxygen and chlorine can be used.

(Multistep Formation)

Next, the step structure 151 is etched by using the etching mask 160 asa mask to form the first step structure 21 of the lower step and thesecond step structure 22 of the upper step (FIG. 23C), and after that,the etching mask 160 is removed (FIG. 24D).

The value of the step difference (H102) of the second step structure 22illustrated in FIG. 23C is the same as the value of the step difference(H1) of the second step structure 22 of the template substrate 4illustrated in FIG. 13 and can be set to be in a range of 1 μm or moreand 5 μm or less. If the step difference is several μm or less, the stepdifference can be sufficiently formed in terms of time by dry etching.

Therefore, by using the dry etching, the cross-sectional shape of thepart where the second step structure 22 and the upper surface of thefirst step structure 21 are in contact with each other can be formed ata right angle compared to the case of formation by wet etching.

Herein, the material constituting the one step template substrate 150 isgenerally synthetic quartz, and dry etching by using a fluorine-basedgas can be appropriately used for the etching.

In addition, in the case of using a material containing chromium (Cr),for example, removal of the etching mask 160 can be performed by dryetching by using a mixed gas of oxygen and chlorine.

Alternatively, removal of the etching mask may be performed by wetetching by using an aqueous solution containing ceric ammonium nitrateand perchloric acid.

(Light Shielding Material Layer Formation)

Next, a light shielding material layer 170 is formed on the uppersurface of the first step structure 21 and on the upper surface of thesecond step structure 22 to obtain a multistep template substrate 300with the light shielding material layer (FIG. 24E).

Incidentally, in the multistep template substrate 300 with the lightshielding material layer illustrated in FIG. 24E, the light shieldingmaterial layer 170 is also formed on the main surface 11 of the base 10.However, in the production method of the template substrate forimprinting according to the present invention, the light shieldingmaterial layer 170 on the main surface 11 is usually removed in thesteps of FIGS. 18E to 18F.

As a material constituting the light shielding material layer 170, forexample, a material containing at least one of a metal material andoxide, nitride, and oxynitride thereof can be used. Specific examples ofthe above-mentioned metal material which can be used include chromium(Cr), molybdenum (Mo), tantalum (Ta), tungsten (W), zirconium (Zr), andtitanium (Ti).

Herein, in order to prevent irradiation with exposure light, it ispreferable that the light shielding material layer 170 has atransmittance of 10% or less at a wavelength of 365 nm.

For example, in a case where chromium (Cr) is used as a material of thelight shielding material layer 170, the thickness of the light shieldingmaterial layer 170 may be 15 nm or more.

As a method of forming the light shielding material layer 170,sputtering film formation which has been proven in the production of aphotomask, for example, can be appropriately exemplified.

<Production Method of Template for Imprinting>

Next, a production method of a template for imprinting according to thepresent invention will be described.

The production method of a template for imprinting according to thepresent invention is substantially divided into a first embodiment and asecond embodiment. Hereinafter, the first embodiment and the secondembodiment will be described.

A. First Embodiment

First, the first embodiment of the production method of a template forimprinting according to the present invention will be described.

As a production method of the template 1 having the first step structure21 on the main surface of the base 10, having the second step structure22 on the first step structure 21, having the light shielding film 31 onthe upper surface of the first step structure 21, and having thetransfer pattern 23 of the concave and convex structure on the uppersurface of the second step structure 22 as illustrated in FIG. 14, amethod of forming the desired transfer pattern 23 having a concave andconvex structure by preparing the template substrate 4 produced by theproduction method of the template substrate for imprinting andperforming the same step on the upper surface of the second stepstructure 22 as the production method of the template for imprinting inthe related art as illustrated in FIG. 13 can be exemplified.

The above-described methods of producing the template for imprinting inthe related art include a method of forming resist patterns of thetransfer pattern 23, for example, by using an electron beam lithographytechnique and a method of forming resin patterns of the transfer pattern23 by using an imprinting technique.

B. Second Embodiment

Next, the second embodiment of the production method of the template forimprinting according to the present invention will be described.

In this production method, by preparing the multistep template 700 withthe light shielding material layer in which the transfer pattern of theconcave and convex structure has already been formed and performing thesame step as the above-described production method of the templatesubstrate for imprinting according to the present invention, forexample, as illustrated in FIG. 14, the template 1 having the first stepstructure 21 on the main surface of the base 10, having the second stepstructure 22 on the first step structure 21, having the light shieldingfilm 31 on the upper surface of the first step structure 21, and havingthe transfer pattern 23 of the concave and convex structure on the uppersurface of the second step structure 22 is produced.

The above-described multistep template 700 with the light shieldingmaterial layer can be produced, for example, by preparing a templatehaving the same configuration as the template in the related art, thatis, a one step template 500 having a one step structure on the mainsurface of the base and having a transfer pattern 23 of a concave andconvex structure on the upper surface of the step structure andperforming the same steps as the production method of the multisteptemplate substrate with the light shielding material layer according tothe present invention (the first embodiment described later).

Hereinafter, first, the production method of the multistep template withthe light shielding material layer according to the second embodimentwill be described. Next, the method (the production method of thetemplate for imprinting according to the second embodiment) of producingthe template for imprinting according to the present invention from themultistep template with the light shielding material layer will bedescribed. In addition, subsequently, the method (the production methodof the template for imprinting according to the second embodiment) ofproducing the template for imprinting having the high contrast filmaccording to the present invention from the multistep template with thelight shielding material layer will be described.

Incidentally, in order to avoid complication, the descriptions ofmatters overlapping with matters described in detail in the productionmethod of the template substrate for imprinting according to the presentinvention will be omitted as appropriate.

<Production Method of Multistep Template with Light Shielding MaterialLayer>

The production method of the multistep template with the light shieldingmaterial layer according to the second embodiment is substantiallydivided into the first embodiment and the second embodiment.Hereinafter, the first embodiment and the second embodiment will bedescribed.

a. First Embodiment

FIG. 25 is a flowchart illustrating an example of the production methodof the multistep template with the light shielding material layeraccording to the first embodiment. In addition, FIGS. 26A to 26C and 27Dto 27E are schematic process diagrams illustrating the example of theproduction method of the multistep template with the light shieldingmaterial layer according to the first embodiment.

(One Step Template Preparation)

For example, in order to produce the multistep template 700 with thelight shielding material layer by the production method of thisembodiment, first, a one step template 500 having a one step structure501 on the main surface 11 of the base 10 and having a transfer pattern23 with a concave and convex structure on the upper surface of the stepstructure 501 is prepared (S111 in FIG. 25, FIG. 26A).

This one step template 500 is made of the same material as the templatefor imprinting in the related art.

In addition, the one step template 500 has a configuration similar tothat of the template for imprinting in the related art, and for example,the height H501 of the step structure 501 is a height which is the sameas or similar to the step difference of the template having a one stepstructure used in the photo imprinting method in the related art and istypically about 30 μm.

In addition, it is preferable that a depression part 40 is provided onthe back surface 12 side of the base 10 of the one step template 500.

However, the upper surface of the step structure 501 of the one steptemplate 500 has an area larger than the upper surface of the secondstep structure 22 of the finally obtained template 1.

This is because the outer peripheral part of the upper surface of thestep structure 501 of the one step template 500 is etched to form theupper surface of the first step structure 21 as described later.

That is, the upper surface of the step structure 501 of the one steptemplate 500 is wider than the transfer pattern region (equal to theupper surface of the second step structure 22 of the template 1) in thetemplate 1, and the transfer pattern 23 formed in the one step template500 is formed in a region which is to be the transfer pattern region inthe template 1.

(Etching Mask Formation)

Next, an etching mask 160 is formed in a region which is to be atransfer pattern region on the upper surface of the step structure 501of the one step template 500 (S112 in FIG. 25, FIG. 26B).

(Multistep Formation)

Next, the step structure 501 is etched by using the etching mask 160 toform the first step structure 21 of the lower step and the second stepstructure 22 of the upper step, and after that, the etching mask 160 isremoved (S113 in FIG. 25, FIG. 26C, FIG. 27D).

The value of the step difference (H502) of the second step structure 22illustrated in FIG. 26C is the same as the value of the step difference(H1) of the second step structure 22 of the template 1 illustrated inFIG. 14 and can be set in a range of 1 μm or more and 5 μm or less. Ifthe step difference is several μm or less, the step difference can besufficiently formed in terms of time by dry etching.

Therefore, by using the dry etching, the cross-sectional shape of thepart where the second step structure 22 and the upper surface of thefirst step structure 21 are in contact with each other can be formed ata right angle compared to the case of formation by wet etching.

(Light Shielding Material Layer Formation)

Next, a light shielding material layer 170 is formed on the uppersurface of the first step structure 21 and on the upper surface of thesecond step structure 22 to obtain a multistep template 700 with thelight shielding material layer (S114 in FIG. 25, FIG. 27E).

Incidentally, in the multistep template 700 with the light shieldingmaterial layer illustrated in FIG. 27E, the light shielding materiallayer 170 is also formed on the main surface 11 of the base 10, but inthe production method of the template for imprinting according to thepresent invention, the light shielding material layer 170 on the mainsurface 11 is usually removed.

b. Second Embodiment

FIG. 28 is a flow chart illustrating another example of the productionmethod of the multistep template with the light shielding material layeraccording to the second embodiment. In addition, FIGS. 29A to 29C and30D to 30F are schematic process diagrams illustrating another exampleof the production method of the multistep template with the lightshielding material layer according to the second embodiment.

(One Step Template Substrate Preparation)

For example, in order to produce the multistep template 700 with thelight shielding material layer by the production method according to thepresent embodiment, first, a one step template substrate 150 having aone step structure 151 on the main surface 11 of the base 10 is prepared(S211 in FIG. 28, FIG. 29A).

Since the material constituting the one step template substrate 150illustrated in FIG. 29A is similar to that of the one step templatesubstrate 150 illustrated in FIG. 23, the description thereof will beomitted herein.

In the one step template substrate 150 illustrated in FIG. 29(a), sincethe height H201 of the step structure 151 is similar to the height H101of the step structure 151 of the one step template substrate 150illustrated in FIG. 23, the description thereof will be omitted herein.

In addition, similarly to the one step template substrate 150illustrated in FIG. 23, it is preferable that a depression part 40 isprovided on the back surface 12 side of the base 10 of the one steptemplate substrate 150 illustrated in FIG. 29A.

(Etching Mask Formation)

Next, an etching mask 160 is formed in a region which is to be the firstconcave and convex structure body constituting the transfer pattern onthe upper surface of the step structure 151 of the one step templatesubstrate 150 and the second concave and convex structure bodyconstituting the alignment mark (S212 in FIG. 28, FIG. 29B).

Incidentally, the above “a region which is to be the first concave andconvex structure body constituting the transfer pattern and the secondconcave and convex structure body constituting the alignment mark”denotes a region where the first concave and convex structure body 22 aand the second concave and convex structure body 22 b are formed in thetemplate 1 for imprinting (FIG. 38L) finally produced through themultistep template 700 (FIG. 30F) with the light shielding materiallayer produced from the one step template substrate 150.

Since the material constituting the etching mask 160 is similar to thematerial constituting the etching mask 160 illustrated in FIG. 23B, thedescription thereof will be omitted herein.

Since the method of forming the etching mask 160 is similar to themethod of forming the etching mask 160 illustrated in FIG. 23B, thedescription thereof will be omitted herein.

(Multistep Formation)

Next, the step structure 151 is etched by using the etching mask 160 asa mask to form the first step structure 21 of the lower step and thesecond step structure 22 of the upper step, and after that, the etchingmask 160 is removed (S213 in FIG. 28, FIG. 29C, FIG. 30D).

The value of the step difference (H202) of the second step structure 22illustrated in FIG. 29(c) is the same as the value of the stepdifference (H1) of the second step structure 22 of the template 1illustrated in FIG. 14 and can be set in a range of 1 μm or more and 5μm or less. If the step difference is several μm or less, the stepdifference can be sufficiently formed in terms of time by dry etching.

Therefore, by using the dry etching, the cross-sectional shape of thepart where the second step structure 22 and the upper surface of thefirst step structure 21 are in contact with each other can be formed ata right angle compared to the case of formation by wet etching.

Herein, similarly to the case of etching the one step structure 151 ofthe one step template substrate 150 illustrated in FIG. 23B, dry etchingby using a fluorine-based gas can be appropriately used for the aboveetching.

In addition, since the method of removing the etching mask 160 issimilar to the method of removing the etching mask 160 illustrated inFIG. 23C, the description thereof will be omitted herein.

(Transfer Pattern Formation)

Next, a first concave and convex structure body 22 a constituting thetransfer pattern 23 and a second concave and convex structure body 22 bconstituting the alignment mark are formed on the upper surface of thesecond step structure 22 to obtain a multistep template 600 (S214 inFIG. 28, FIG. 30E).

As a method of forming the first concave and convex structure body 22 aand the second concave and convex structure body 22 b, a method offorming the desired first concave and convex structure body 22 a and thedesired second concave and convex structure body 22 b by performing thesame step as the production method of the template for imprinting in therelated art can be exemplified.

The above-described methods of producing the template for imprinting inthe related art include a method of forming resist patterns of the firstconcave and convex structure body 22 a and the second concave and convexstructure body 22 b, for example, by using an electron beam lithographytechnique and a method of forming resin patterns of the first concaveand convex structure body 22 a and the second concave and convexstructure body 22 b by using an imprinting technique.

(Light Shielding Material Layer Formation)

Next, a light shielding material layer 170 is formed on the main surface11 of the base 10, on the upper surface of the first step structure 21,and on the upper surface of the second step structure 22 to form amultistep template 700 with the light shielding material layer (S215 inFIG. 28, FIG. 30F).

Incidentally, in the multistep template 700 with the light shieldingmaterial layer illustrated in FIG. 30F, the light shielding materiallayer 170 is also formed on the main surface 11 of the base 10. However,in the production method of the template for the imprinting according tothe present invention hereinafter, the light shielding material layer170 on the main surface 11 is usually removed.

Since the material constituting the light shielding material layer 170is similar to the material constituting the light shielding film 31 inthe template 1 illustrated in FIG. 5, the description thereof will beomitted herein. Since the thickness of the light shielding materiallayer 170 is similar to the thickness constituting the light shieldingfilm 31 in the template 1 illustrated in FIG. 5, the description thereofwill be omitted herein.

c. Production Method of Multistep Template with Light Shielding MaterialLayer According to Second Embodiment

As described above, as the production method of the multistep templatewith the light shielding material layer according to the secondembodiment, any one of the first embodiment as illustrated in FIGS. 25,26A to 26C, and 27D to 27F, and the second embodiment as illustrated inFIGS. 28, 29A to 29C, and 30D to 30F may be employed, but the secondembodiment is more preferable than the first embodiment. Unlike in thefirst embodiment, in the second embodiment, this is because, in the stepof forming the transfer pattern after the step of the multistepformation, the formation of the concave and convex structure body on theupper surface of the second step structure 22, which is finer than themultistep formation, is performed, so that the risk of damage anddestruction of the concave and convex structure body is reduced.

<Production Method of Template for Imprinting>

Next, a method (a production method of a template for imprintingaccording to the second embodiment) of producing the template 1 forimprinting according to the present invention from the multisteptemplate 700 with the light shielding material layer obtained above willbe described.

FIG. 31 is a flowchart illustrating an example of the production methodof the template according to the second embodiment. FIGS. 32A to 32C and33D to 33F are schematic process diagrams illustrating the example ofthe production method of the template according to the secondembodiment.

(Multistep Template with Light Shielding Material Layer Preparation)

For example, in order to produce the template 1 according to thisproduction method, first, a multistep template 700 with a lightshielding material layer having a first step structure 21 and a secondstep structure 22, having a transfer pattern 23 of a concave and convexstructure on an upper surface of the second step structure 22, andhaving the light shielding material layer 170 on an upper surface of thefirst step structure 21 and on the upper surface of the second stepstructure 22 is prepared (S100 in FIG. 31, FIG. 32A).

In the multistep template 700 with the light shielding material layer,the combined height of the first step structure 21 and the second stepstructure 22 is a height which is the same as or similar to the stepdifference of the template substrate having a one step structure used inthe photo imprinting method in the related art and is typically about 30μm. In addition, it is preferable that a depression part 40 is providedon the back surface 12 side of the base 10.

The multistep template 700 with the light shielding material layer canbe produced, for example, by the method (FIGS. 25 to 27E) of producingthe multistep template with the light shielding material layer accordingto the first embodiment.

(Resin Layer Formation)

Next, as illustrated in FIG. 32B, by dropping the first resin 51 a ontothe light shielding material layer 170 formed on the upper surface ofthe first step structure 21, dropping the second resin 52 a onto thelight shielding material layer 170 formed on the upper surface of thesecond step structure 22, after that, as illustrated in FIG. 32C,pressing the template 400 for thickness regulation of the resin todefine the thickness of each resin, curing the first resin 51 a and thesecond resin 52 a in this state, and after that, releasing the template400 for thickness regulation of the resin, as illustrated in FIG. 33D,the first resin layer 51 and the second resin layer 52, each having adefined thickness, are obtained (S200 in FIG. 31).

The thickness of the second resin layer 52 can be formed to be smallerthan the thickness of the first resin layer 51 by using the template 400for thickness regulation of the resin having a predetermined form.

In addition, by using the template 400 for thickness regulation of theresin, the first resin layer 51 can be formed as a resin layer having auniform thickness.

(Second Resin Layer Removal)

Next, as illustrated in FIG. 33E, the second resin layer 52 is removedwhile allowing the first resin layer 51 to remain by dry etching(etch-back) by using the etching gas 75.

As described above, since the thickness of the second resin layer 52 issmaller than the thickness of the first resin layer 51, by the etch-backmethod, the second resin layer 52 can be removed while allowing thefirst resin layer 51 to remain.

(Light Shielding Film Formation)

Next, by etching the light shielding material layer 170 exposed from thefirst resin layer 51 by using the remaining first resin layer 51 as amask, the light shielding material layer 170 formed on the upper surfaceof the second step structure 22 is removed while allowing the lightshielding material layer 170 formed on the upper surface of the firststep structure 21 to remain, which is to be a light shielding film 31.

After that, by removing the remaining first resin layer 51, asillustrated in FIG. 33F, the template 1 having the first step structure21 on the main surface 11 of the base 10, having the second stepstructure 22 on the first step structure 21, having the transfer pattern23 of the concave and convex structure on the upper surface of thesecond step structure 22, and having the light shielding film 31 on theupper surface of the first step structure 21 can be obtained.

<Production Method of Template for Imprinting Having High Contrast Film>

Next, a production method (production method of a template forimprinting according to the second embodiment) of the template 1 forimprinting having a high contrast film according to the presentinvention from the multistep template 700 with the light shieldingmaterial layer obtained above will be described.

FIG. 34 is a flowchart illustrating another example of the productionmethod of the template according to the second embodiment. In addition,FIGS. 35A to 35C, 36D to 36F, 37G to 37I, and 38J to 38L are schematicprocess diagrams illustrating another example of the production methodof the template according to the second embodiment.

(Multistep Template with Light Shielding Material Layer Preparation)

For example, in order to produce the template 1 by this productionmethod, first, a multistep template 700 with a light shielding materiallayer having a first step structure 21 and a second step structure 22,having a first concave and convex structure body 22 a constituting atransfer pattern 23 and a second concave and convex structure body 22 bconstituting an alignment mark on an upper surface of the second stepstructure 22, and having a light shielding material layer 170 on anupper surface of the first step structure 21 and on the upper surface ofthe second step structure 22, is prepared (S100 in FIG. 34, FIG. 35A).

In the multistep template 700 with the light shielding material layer,the combined height of the first step structure 21 and the second stepstructure 22 is a height which is the same as or similar to the stepdifference of the template substrate having a one step structure used inthe photo imprinting method in the related art and is typically about 30μm. In addition, it is preferable that a depression part 40 is providedon the back surface 12 side of the base 10.

The multistep template 700 with the light shielding material layer canbe produced by, for example, the production method of the multisteptemplate with the light shielding material layer according to the secondembodiment (FIGS. 28 to 30F).

(Formation of First and Second Resin Layers)

Next, as illustrated in FIG. 35B, by dropping the first resin 51 a ontothe light shielding material layer 170 formed on the upper surface ofthe first step structure 21, dropping the second resin 52 a onto thelight shielding material layer 170 formed on the upper surface of thesecond step structure 22, after that, as illustrated in FIG. 35C,pressing the template 430 for thickness regulation of the first andsecond resins to define the thickness of each resin, curing the firstresin 51 a and the second resin 52 a in this state, and after that,releasing the template 430 for thickness regulation of the first andsecond resins, as illustrated in FIG. 36D, the first resin layer 51 andthe second resin layer 52, each having a defined thickness, are obtained(S200 in FIG. 34).

By using the template 430 for thickness regulation of the first andsecond resins having predetermined shapes, the thickness of the secondresin layer 52 can be formed so as to be smaller than the thickness ofthe first resin layer 51. More specifically, as a form of the template430 for thickness regulation of first and second resins, for example,similarly to the form of the template 400 for thickness regulation ofthe resin, a form in which the depth of the concave part 432 on the mainsurface side which is in contact with the resin is smaller than theheight (the same as the height from the upper surface of the first stepstructure 21 of the template 1 for imprinting to the upper surface ofthe second step structure 22 described later) from the upper surface ofthe first step structure 21 to the upper surface of the second stepstructure 22 of the multistep template 700 with the light shieldingmaterial layer can be exemplified.

In addition, by using the template 430 for thickness regulation of thefirst and second resins, similarly to the case of using the template 400for thickness regulation of the resin as described above, the firstresin layer 51 can be formed as a resin layer having a uniformthickness.

(Second Resin Layer Removal)

Next, as illustrated in FIG. 36E, by dry etching (etch-back) by usingthe etching gas 75, the second resin layer 52 is removed while allowingthe first resin layer 51 to remain (S300 in FIG. 34).

As described above, since the thickness of the second resin layer 52 issmaller than the thickness of the first resin layer 51, by the etch-backmethod, the second resin layer 52 can be removed while allowing thefirst resin layer 51 to remain.

(Light Shielding Film Formation)

Next, by using the remaining first resin layer 51 as a mask, the lightshielding material layer 170 exposed from the first resin layer 51 isetched, so that while allowing the light shielding material layer 170formed on the upper surface of the first step structure 21 which is tobe the light shielding film 31 to remain, the light shielding materiallayer 170 formed on the main surface 11 of the base 10 and on the uppersurface of the second step structure 22 is removed.

After that, by removing the remaining first resin layer 51, asillustrated in FIG. 36F, the template 1 having the first step structure21 on the main surface 11 of the base 10, having the second stepstructure 22 on the first step structure 21, having the first concaveand convex structure body 22 a constituting the transfer pattern 23 andthe second concave and convex structure body 22 b constituting thealignment mark on the upper surface of the second step structure 22, andhaving the light shielding film 31 on the upper surface of the firststep structure 21 can be obtained (S400 in FIG. 34).

(High Contrast Layer Formation)

Next, in the template 1 having the light shielding film 31 on the uppersurface of the first step structure 21, the high contrast layer 330 isformed on the main surface 11 of the base 10, on the light shieldingfilm 31, on the upper surface of the convex part and the bottom surfaceof the concave part of the first concave and convex structure body 22 a,and on the upper surface of the convex part and the bottom surface ofthe concave part of the second concave and convex structure body 22 b(S500 in FIG. 34, FIG. 37G).

Since the material constituting the high contrast layer 330 is similarto the material constituting the high contrast film 32 in the template 1illustrated in FIG. 5, the description thereof will be omitted herein.Since the thickness of the high contrast layer 330 is similar to thethickness constituting the high contrast film 32 in the template 1illustrated in FIG. 5, the description thereof will be omitted herein.

(Formation of Third to Fifth Resin Layers)

Next, a third resin 53 a is dropped onto the high contrast layer 330formed on the light shielding film 31, a fourth resin 54 a is droppedonto a high contrast layer 330 formed on the upper surface of the convexpart and the bottom surface of the concave part of the first concave andconvex structure body 22 a, and a fifth resin 55 a is dropped onto thehigh contrast layer 330 formed on the upper surface of the convex partand the bottom surface of the concave part of the second concave andconvex structure body 22 b (FIG. 37H).

Next, the template 440 for thickness regulation of the third to fifthresins are pressed, and in this state, the third resin 53 a, the fourthresin 54 a, and the fifth resin 55 a are cured (FIG. 37I). After that,the template 440 for thickness regulation of the third to fifth resinsis released (FIG. 38J). Therefore, a third resin layer 53 is formed onthe high contrast layer 330 formed on the light shielding film 31, afourth resin layer 54 having a thickness smaller than that of the thirdresin layer 53 is formed on the high contrast layer 330 formed on theupper surface of the convex part and the bottom surface of the concavepart of the first concave and convex structure body 22 a, and a fifthresin layer 55 having a thickness larger than that of the fourth resinlayer 54 is formed on the high contrast layer 330 formed on the uppersurface of the convex part and the bottom surface of the concave part ofthe second concave and convex structure body 22 b (S600 in FIG. 34, FIG.38J).

Herein, in the present invention, as illustrated in FIG. 40 to bedescribed later, in a case where the thickness of the third resin layer53 is regarded as T53 and the thickness of the fourth resin layer 54formed on the bottom surface of the concave part of the first concaveand convex structure body 22 a is regarded as T54, “a fourth resin layerhaving a thickness smaller than that of the third resin layer” denotesthe fourth resin layer 54 satisfying T54<T53. In addition, asillustrated in FIG. 40 to be described later, in a case where thethickness of the fourth resin layer 54 formed on the bottom surface ofthe concave part of the first concave and convex structure body 22 a isregarded as T54 and the thickness of the fifth resin layer 55 formed onthe bottom surface of the concave part of the second concave and convexstructure body 22 b is regarded as T55, “a fifth resin layer having athickness larger than that of the fourth resin layer” denotes the fifthresin layer 55 satisfying T54<T55.

When these resin layers are formed, as illustrated in FIG. 37I, by usingthe template 440 for thickness regulation of the third to fifth resinshaving a concave part 442 on the main surface side in contact with theresin and having the depression 442 a formed on the bottom surface sideof the concave part 442, the upper surface of the outer peripheral partof the concave part 442 of the template 440 for thickness regulation ofthe third to fifth resins is pressed against the third resin 53 a, thebottom surface of the concave part 442 of the template 440 for thicknessregulation of the third to fifth resins is pressed against the fourthresin 54 a and the fifth resin 55 a, and the bottom surface of thedepression 442 a is pressed against the fifth resin 55 a. As a result,the thicknesses of the third resin layer 53, the fourth resin layer 54,and the fifth resin layer 55 can be defined as described above. Inaddition, the third resin layer 53, the fourth resin layer 54, and thefifth resin layer 55 can be formed as a resin layer having a uniformthickness.

The third resin 53 a, the fourth resin 54 a, and the fifth resin 55 aare made of a material that is cured by heat or light and are preferablyultraviolet curable resins used in the field of nanoimprint lithography.

In a case where the third resin 53 a, the fourth resin 54 a, and thefifth resin 55 a are ultraviolet curable resins, in the step of curingthe third resin 53 a, the fourth resin 54 a, and the fifth resin 55 a,as illustrated in FIG. 37I, a method of irradiating with ultravioletlight 65 can be used.

Incidentally, the third resin 53 a, the fourth resin 54 a, and the fifthresin 55 a may be made of different materials as long as the upper sidesof the third resin layer 53 and the fifth resin layer 55 and the fourthresin layer 54 can be removed by dry etching in the fourth resin layerremoving step described later (S700 in FIG. 34, FIG. 38K) while allowingthe lower sides of the third resin layer 53 and the fifth resin layer 55to remain. However, from the viewpoint of ease of handling, it ispreferable that these resins are made of the same material.

(Fourth Resin Layer Removal)

Next, by dry etching (etch-back) using the etching gas 75, the uppersides of the third resin layer 53 and the fifth resin layer 55 and thefourth resin layer 54 are removed while allowing the lower sides of thethird resin layer 53 and the fifth resin layer 55 to remain (S700 inFIG. 34, FIG. 38K).

As described above, since the thickness T54 of the fourth resin layer 54is smaller than the thickness T53 of the third resin layer 53 and thethickness T55 of the fifth resin layer 55, by the etch-back method, thefourth resin layer 54 can be removed while allowing the lower sides ofthe third resin layer 53 and the fifth resin layer 55 to remain.

As the etching gas 75, for example, oxygen gas can be used.

(High Contrast Film Formation)

By using the lower sides of the remaining third resin layer 53 and theremaining fifth resin layer 55 as masks, the high contrast layer 330 isetched, so that while allowing the high contrast layer 330 formed on thelight shielding film 31 and the bottom surface of the concave part ofthe second concave and convex structure body 22 b to remain, the highcontrast layer 330 formed on the main surface 11 of the base 10, theupper surface of the convex part and the bottom surface of the concavepart of the first concave and convex structure body 22 a and the uppersurface of the convex part of the second concave and convex structurebody 22 b is removed, and the remaining third resin layer 53 and theremaining fifth resin layer 55 are removed (S800 in FIG. 34, FIG. 38L).

Therefore, it is possible to obtain the template 1 which has the firstconcave and convex structure body 22 a constituting the transfer pattern23 and the second concave and convex structure body 22 b constitutingthe alignment mark on the upper surface of the second step structure 22and in which the high contrast film 32 is formed on the light shieldingfilm 31 and on the bottom surface of the concave part of the secondconcave and convex structure body 22 b (FIG. 38L). Incidentally, thetemplate 1 for imprinting having the high contrast film 32 illustratedin FIG. 38L is the same as the template 1 illustrated in FIG. 5.

(Template for Thickness Regulation of Resin)

FIGS. 39A and 39B are diagrams illustrating another example of thetemplate for specifying resin thickness according to the presentinvention. Herein, FIG. 39A illustrates a schematic bottom diagram ofthe template 440 for thickness regulation of the third to fifth resins,and FIG. 39B illustrates a cross cross-sectional diagram taken alongline A-A in FIG. 39A. Incidentally, the template 440 for thicknessregulation of the third to fifth resins illustrated in FIGS. 39A and 39Bis the same as the template 440 for thickness regulation of the third tofifth resins illustrated in FIG. 37I.

For example, the template 440 for thickness regulation of the third tofifth resins illustrated in FIGS. 39A and 39B has the concave parts 442on the main surface side (the lower side in FIG. 39B) in contact withthe resin and has the depression 442 a formed on the bottom surface sideof the concave part 442. The form of the template 440 for thicknessregulation of the third to fifth resins is the form where the outer edgeof the upper surface of the outer peripheral part of the concave part442 reaches the outer edge of the template 440 for thickness regulationof the third to fifth resins.

More specifically, as illustrated in FIG. 37I, in a planar view, theconcave part 442 of the template 440 for thickness regulation of thethird to fifth resins has a size of enclosing the upper surface of thesecond step structure 22 of the template 1 in which the high contrastlayer 330 is formed and being enclosed in a region surrounded by theouter edge of the upper surface of the first step structure 21 of thetemplate 1 in which the high contrast layer 330 is formed.

FIG. 40 is a diagram illustrating the function and effect of thetemplate for specifying resin thickness according to the presentinvention. FIG. 40 corresponds to an enlarged diagram of the main partsin FIG. 37I.

For example, as illustrated in FIG. 40, when defining the thicknesses ofthe third resin layer 53, the fourth resin layer 54, and the fifth resinlayer 55 by pressing the template 440 for thickness regulation of thethird to fifth resins, in a case where, the height from the uppersurface of the high contrast layer 330 formed on the light shieldingfilm 31 to the upper surface of the high contrast layer 330 formed onthe bottom surface of the concave part of the first concave and convexstructure body 22 a is regarded as H53, the depth of a part other thanthe depression 442 a in the concave part 442 is regarded as H54, thethickness of the third resin layer 53 to be formed is regarded as T53,and the thickness (the same as the thickness of the fourth resin layer54 formed on the bottom surface of the concave part of the first concaveand convex structure body 22 a) of the fourth resin layer 54 to beformed is regarded as T54, by designing so that H54<H53, a relationshipof T54<T53 is obtained. In addition, as illustrated in FIG. 40, in acase where the depth of the depression 442 a formed on the bottomsurface side of the concave part 442 is regarded as H55, design is madesuch that H55<H54, and the thickness of the fifth resin layer 55 to beformed (the thickness of the fourth resin layer 54 formed on the bottomsurface of the concave part of the second concave and convex structurebody 22 b) is T55, T54<T55 is obtained.

Therefore, by using the template 440 for thickness regulation of thethird to fifth resins in the step illustrated in FIG. 37I, the thicknessT54 of the fourth resin layer 54 can be formed so as to be smaller thanthe thickness T53 of the third resin layer 53, and the thickness T55 ofthe fifth resin layer 55 can be formed so as to be larger than thethickness T54 of the fourth resin layer 54. In addition, by using thetemplate 440 for thickness regulation of the third to fifth resins, thethird resin layer 53, the fourth resin layer 54, and the fifth resinlayer 55 can be formed as resin layers having a uniform thickness.

As a result, as illustrated in FIG. 38K, after the upper sides of thethird resin layer 53 and the fifth resin layer 55 the fourth resin layer54 are removed by dry etching while allowing the lower side of the thirdresin layer 53 and the fifth resin layer 55 to remain, as illustrated inFIG. 38L, by using the lower sides of the remaining third resin layer 53and the remaining fifth resin layer 55 as masks, the high contrast layer330 is etched, so that the lower side of the high contrast layer 330formed on the light shielding film 31 and on the bottom surface of theconcave part of the second concave and convex structure body 22 b can beallowed to remain. In addition, the high contrast film 32 which is thehigh contrast layer 330 remaining on the light shielding film 31 and thehigh contrast film 32 which is the high contrast layer 330 remaining onthe bottom surface of the concave part of the second concave and convexstructure body 22 b can be formed as a film without a defective part ora thin film part.

For example, the depth H54 of the part other than the depression 442 ain the concave part 442 can be set to be in a range of 0.3 μm or moreand 10 μm or less. In addition, as illustrated in FIG. 40, in a casewhere the depth of the depression 442 a formed on the bottom surfaceside of the concave part 442 is regarded as H55 and the depth of theconcave part of the first concave and convex structure body 22 a and thesecond concave and convex structure body 22 b is regarded as H60, arelationship of H55≥H60 is satisfied. Therefore, the high contrast film32 (the high contrast layer 330) can be removed from the top of thefirst concave and convex structure body 22 a without any residue. Morespecifically, for example, H55 is set to be within a range of H60×1.0 toH60×2.0.

Herein, it is preferable that the bottom surface of the concave part 442of the template 440 for thickness regulation of the third to fifthresins has a size of enclosing the upper surface of the second stepstructure 22 of the template 1 in which the high contrast layer 330illustrated in FIG. 37I is formed.

More specifically, in a case where the width of the bottom surface ofthe concave part 442 of the template 440 for thickness regulation of thethird to fifth resins illustrated in FIG. 39B is regarded as L21 and thewidth of the upper surface of the second step structure 22 of thetemplate 1 in which the high contrast layer 330 illustrated in FIG. 37Iis formed is regarded as L11, it is preferable that a relationship ofL21>L11 is satisfied.

This is because the step of pressing the template 440 for thicknessregulation of the third to fifth resins and the step of releasing thetemplate 440 for thickness regulation of the third to fifth resins fromthe template 1 in which the high contrast layer 330 is formed becomeeasier.

For example, a bottom surface size of the concave part 442 can be set tobe in a range of 10 mm×10 mm or more and 70 mm×70 mm or less.

In addition, it is preferable that the region surrounded by the outeredge of the upper surface of the outer peripheral part of the concavepart 442 of the template 440 for thickness regulation of the third tofifth resins has the same shape and the same area as the regionsurrounded by the outer edge of the upper surface of the first stepstructure 21 of the template 1 in which the high contrast layer 330illustrated in FIG. 37I is formed or has a size of enclosing the regionsurrounded by the outer edge of the upper surface of the first stepstructure 21 of the template 1 in which the high contrast layer 330 isformed.

More specifically, in a case where the width of the region surrounded bythe outer edge of the upper surface of the outer peripheral part of theconcave part 442 of the template 440 for thickness regulation of thethird to fifth resins illustrated in FIG. 39B is regarded as L22 and thewidth of the region surrounded by the outer edge of the upper surface ofthe first step structure 21 of the template 1 in which the high contrastlayer 330 illustrated in FIG. 37I is formed is regarded as L12, it ispreferable that a relationship of L22≥L12 is satisfied.

This is because the third resin layer 53 can be formed as a resin layerhaving a uniform thickness without a defective part to the extent ofreaching the outer edge of the upper surface of the first step structure21 of the template 1 in which the high contrast layer 330 is formed.

In addition, the template 430 for thickness regulation of the first andsecond resins illustrated in FIG. 35C has marks for position matching435 on the main surface side. For this reason, as illustrated in FIG.35C, when pressing the template 430 for thickness regulation of thefirst and second resins, the relative positions with respect to themultistep template 700 with the light shielding material layer where thecorresponding alignment marks (not illustrated) are formed can bealigned, and thus, the pressing can be performed with good positionalaccuracy.

Incidentally, the marks for position matching 435 illustrated in FIG.35C are depressions 435 a formed outside the concave part 432 on themain surface side of the template 430 for thickness regulation of thefirst and second resins. In the template 430 for thickness regulation ofthe first and second resins, the concave part 432 and the depressions435 a formed outside the concave part 432 are formed in separate steps.More specifically, after one of the concave part 432 and the depressions435 a is processed, positioning is performed by alignment drawing, andthe other is processed. In addition, the depressions 435 a formedoutside the concave part 432 is depressions having a depth (for example,20 nm to 300 nm) of a degree that the marks can be read.

Furthermore, the template 440 for thickness regulation of the third tofifth resins illustrated in FIG. 39 also has marks for position matching435 on the main surface side. For this reason, as illustrated in FIG.37I, when pressing the template 440 for thickness regulation of thethird to fifth resins, the relative positions with respect to thetemplate 1 where the corresponding alignment marks (not illustrated) areformed can be aligned, and thus, the pressing can be performed with goodpositional accuracy.

The marks for position matching 435 illustrated in FIG. 39 aredepressions 435 a formed outside the concave part 442 on the mainsurface side of the template 440 for thickness regulation of the thirdto fifth resins, and the depth H55 of the depression 442 a formed on thebottom surface side of the concave part 442 and the depth H56 of thedepression 435 a of the mark for position matching 435 are the same. Forthis reason, the depression 442 a formed on the bottom surface side ofthe concave part 442 and the depression 435 a of the mark for positionmatching 435 can be formed in the same step.

It is preferable that the template for specifying resin thicknessaccording to the present invention has the marks for position matchingon the main surface side like the template 440 for thickness regulationof the third to fifth resins illustrated in FIG. 39, the mark forposition matching is the depression formed outside the concave part onthe main surface side, and the depth of the depression formed on thebottom surface side of the concave part and the depth of the depressionformed outside the concave part are the same. This is because it ispossible to form the depressions formed on the bottom surface side ofthe concave part and the depressions of the marks for position matchingin the same step.

Although the production method of a template substrate, the productionmethod of a template, and the template according to the presentinvention have been described above, the present invention is notlimited to the above embodiments. The above-described embodiments areexamples, and those having substantially the same configuration andexhibiting the same functions and effects as the technical ideadisclosed in the claims of the invention can are included in thetechnical scope of the invention.

Incidentally, the present invention is not limited to theabove-described embodiments. The above-described embodiments are merelyexamples, and those having substantially the same configuration andexhibiting the same functions and effects as the technical ideadisclosed in the claims of the invention are included in the technicalscope of the invention.

REFERENCE SIGNS LIST

-   -   1 TEMPLATE    -   2 TEMPLATE BLANK    -   10 BASE    -   11 MAIN SURFACE    -   12 BACK SURFACE    -   21 FIRST STEP STRUCTURE    -   22 SECOND STEP STRUCTURE    -   22 a FIRST CONCAVE AND CONVEX STRUCTURE BODY    -   22 b SECOND CONCAVE AND CONVEX STRUCTURE BODY    -   23 TRANSFER PATTERN    -   31 LIGHT SHIELDING FILM    -   32 HIGH CONTRAST FILM 32    -   40 DEPRESSION PART    -   50 TRANSFER SUBSTRATE    -   60 PHOTOCURABLE RESIN    -   61 TRANSFER REGION    -   62 NON-TRANSFER REGION    -   70 LIGHT SHIELDING PLATE    -   81, 82, 83 EXPOSURE LIGHT    -   90, 91, 92 IRRADIATION REGION    -   101 TEMPLATE    -   110 BASE    -   111 MAIN SURFACE    -   121 STEP STRUCTURE    -   122 TRANSFER PATTERN    -   131 LIGHT SHIELDING FILM    -   200 FIRST TEMPLATE BLANK    -   201 STEP STRUCTURE    -   210 FIRST ETCHING MASK    -   220 LIGHT SHIELDING MATERIAL LAYER    -   230 SECOND ETCHING MASK    -   4 TEMPLATE SUBSTRATE    -   51 a FIRST RESIN    -   52 a SECOND RESIN    -   53 a THIRD RESIN    -   54 a FOURTH RESIN    -   55 a FIFTH RESIN    -   51 FIRST RESIN LAYER    -   52 SECOND RESIN LAYER    -   53 THIRD RESIN LAYER    -   54 FOURTH RESIN LAYER    -   55 FIFTH RESIN LAYER    -   65 ULTRAVIOLET LIGHT    -   75 ETCHING GAS    -   150 ONE STEP TEMPLATE SUBSTRATE    -   151 STEP STRUCTURE    -   160 ETCHING MASK    -   170 LIGHT SHIELDING MATERIAL LAYER    -   250 MULTISTEP TEMPLATE SUBSTRATE    -   300 MULTISTEP TEMPLATE SUBSTRATE WITH LIGHT SHIELDING MATERIAL        LAYER    -   330 HIGH CONTRAST LAYER    -   400, 410, 420 TEMPLATE FOR THICKNESS REGULATION OF RESIN    -   401, 411, 421 BASE    -   402, 412, 422 CONCAVE PART    -   403, 413 CONVEX PART    -   404, 414 REGION    -   415 DEPRESSION PART    -   423 OUTER PERIPHERAL PART OF CONCAVE PART    -   430 TEMPLATE FOR THICKNESS REGULATION OF FIRST AND SECOND RESINS    -   432 CONCAVE PART OF TEMPLATE FOR THICKNESS REGULATION OF FIRST        AND SECOND RESINS    -   440 TEMPLATE FOR THICKNESS REGULATION OF THIRD TO FIFTH RESINS    -   442 CONCAVE PART OF TEMPLATE FOR THICKNESS REGULATION OF THIRD        TO FIFTH RESINS    -   442 a DEPRESSION IN CONCAVE PART OF TEMPLATE FOR THICKNESS        REGULATION OF THIRD TO FIFTH RESINS    -   435 MARK FOR POSITION MATCHING    -   500 ONE STEP TEMPLATE    -   501 STEP STRUCTURE    -   600 MULTISTEP TEMPLATE    -   700 MULTISTEP TEMPLATE WITH LIGHT SHIELDING MATERIAL LAYER

The invention claimed is:
 1. A template to be used for imprintlithography transferring a transfer pattern in a concave and convexstructure to a resin on a transfer substrate, the template comprising: abase with a main surface, a first step structure on the main surface, asecond step structure on the first step structure, and the transferpattern at an upper surface of the second step structure; wherein anouter side region of the second step structure at an upper surface ofthe first step structure is covered with a light shielding film, adistance in a vertical direction from the main surface of the base to anupper surface of the light shielding film on the first step structure isH1, a distance in a vertical direction from the main surface of the baseto an upper-most surface of the second step structure is H3, a distancein a horizontal direction from an outer edge of the main surface of thebase to an outer edge of an upper surface of the first step structure isD1, and a distance in a horizontal direction from the outer edge of themain surface of the base to an outer edge of the upper surface of thesecond step structure is D2, and H1≤H3×(D1/D2).
 2. The templateaccording to claim 1, wherein a distance in a vertical direction fromthe main surface of the base to an upper surface of the light shieldingfilm on the first step structure is H1, and a distance in a verticaldirection from a main surface of the base to a bottom surface of aconcave part in the transfer pattern at an upper surface of the secondstep structure is H2, and H1<H2.
 3. The template according to claim 1further comprising a depression part at an opposite side surface to themain surface of the base, wherein the second step structure is interiorto the depression part in a planar view.
 4. The template according toclaim 3, wherein the first step structure is interior to the depressionpart in a planar view.
 5. The template according to claim 1, wherein atransmittance of the light shielding film with a wave length of 365 nmis 10% or less.
 6. A template blank for producing a template to be usedfor imprint lithography transferring a transfer pattern in a concave andconvex structure to a resin on a transfer substrate, the template blankcomprising: a base with a main surface, a first step structure on themain surface, a second step structure on the first step structure;wherein an outer side region of the second step structure at an uppersurface of the first step structure is covered with a light shieldingfilm, a distance in a vertical direction from the main surface of thebase to an upper surface of the light shielding film on the first stepstructure is H1, a distance in a vertical direction from the mainsurface of the base to an upper surface of the second step structure isH4, a distance in a horizontal direction from an outer edge of the mainsurface of the base to an outer edge of an upper surface of the firststep structure is D1, a distance in a horizontal direction from theouter edge of the main surface of the base to an outer edge of the uppersurface of the second step structure is D2, and H1≤H4×(D1/D2) issatisfied.
 7. The template blank according to claim 6, wherein adistance in a vertical direction from the main surface of the base to anupper surface of the light shielding film on the first step structure isH1, and a distance in a vertical direction from the main surface of thebase to an upper surface of the second step structure is H4, and H1<H4.8. The template blank according to claim 6, further comprising adepression part including the second step structure at an opposite sidesurface to the main surface of the base in a planar view.
 9. Thetemplate blank according to claim 8, wherein the depression partincludes the first step structure in a planar view.
 10. The templateblank according to claim 6, wherein a transmittance of the lightshielding film with a wave length of 365 nm is 10% or less.